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W9812G6KB-6 is listed in the Memory IC range at ChipApex. The manufacturer field lists Winbond Electronics. Its product description is IC DRAM 128MBIT LVTTL 54TFBGA. Review the specifications below when checking this part for your BOM.
The W9812G6KB is a high-speed synchronous dynamic random access memory (SDRAM) organized as 2M words x 4 banks x 16 bits. It delivers a data bandwidth of up to 166M words per second with a maximum clock frequency of 166 MHz. The device operates on a 3.3V ± 0.3V power supply and supports CAS latencies of 2 and 3. Burst lengths are programmable to 1, 2, 4, 8, or full page in sequential or interleave modes. Speed grades include -6 (0°C to 70°C), -6I (-40°C to 85°C), and -6J (-40°C to 105°C).
Verify the specific speed grade suffix required for your application temperature range. Confirm that the ordering suffix does not alter the functional specifications unless explicitly stated in the manufacturer's documentation. Cross-reference the part number against the official datasheet revision history to ensure compatibility with existing system designs.
Select the appropriate speed grade based on the operating environment: -6 for commercial temperatures, -6I for industrial ranges, and -6J for extended industrial conditions. Ensure the system design accommodates the 3.3V supply voltage and supports the necessary initialization sequences, including auto-refresh cycles before entering self-refresh mode.
This component belongs to the Winbond W9812G6KB series of SDRAM devices. It is designed for applications requiring high-speed data access and multiple bank interleaving capabilities. The series includes variants sorted by speed and temperature ratings to suit different market segments.
Direct substitutes must match the 16-bit width, 4-bank architecture, and 166MHz clock capability. Verify thermal ratings if replacing a -6 unit with a -6I or -6J variant, as these offer wider operating temperature ranges without changing electrical functionality.
Auto-precharge is entered when A10 is set to high during a Read or Write Command. The active bank begins precharging automatically before all burst read cycles complete.
To exit Self Refresh, CKE must be returned high. Any subsequent commands can be issued after tXSR from the end of the Self Refresh Command.
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