W988D6FBGX6E

Memory IC Overview

The Winbond W988D6FBGX6E is a 256Mb Low Power SDRAM (LPSDR) organized as 4,194,304 words by 16 bits. It operates at a clock frequency of 166MHz with a supply voltage range of 1.7V to 1.95V for both VDD and VDDQ. The device utilizes a 54-ball VFBGA package and supports an extended operating temperature range from -25°C to +85°C. Key features include programmable Partial Array Self Refresh (PASR), Automatic Temperature Compensated Self Refresh (ATCSR), Deep Power Down Mode, and CAS Latency options of 2 or 3.

Memory IC Feature Summary

• Supports low power functions including Programmable Partial Array Self Refresh (PASR) and Automatic Temperature Compensated Self Refresh (ATCSR).
• Features Deep Power Down Mode (DPD) and Power Down Mode for enhanced energy efficiency in battery-operated applications.
• Provides programmable output buffer driver strength and supports burst lengths of 1, 2, 4, 8, and full page.

Memory IC Applications

• 2.5G / 3G cellular phones
• Personal Digital Assistants (PDA)
• Digital still cameras
• Mobile game consoles
• Handheld applications requiring large memory density

Memory IC Procurement Notes

Verify the specific ordering suffix 'E' confirms the -25°C to +85°C extended temperature rating, distinct from the industrial '-I' variant. Confirm the x16 I/O width matches the 54-ball VFBGA package configuration. Ensure compatibility with 1.8V LVCMOS bus interfaces and check for RoHS compliance status in current distributor listings.

Memory IC Selection Notes

Select this component when designing mobile systems requiring 256Mb capacity with low power consumption. The 16-bit data bus width suits applications needing moderate bandwidth without the pin count of 32-bit variants. Consider the 166MHz speed grade for performance requirements and ensure the thermal design accommodates the extended temperature range specifications.

Memory IC Part Context

This part belongs to the Winbond W988D6FB series of Mobile LPSDR devices. It shares architectural similarities with the W988D2FB (x32 version) but differs in I/O width and package type. The series is designed to offer lower power consumption compared to standard SDRAM, targeting portable electronics markets where battery life and memory density are critical constraints.

Memory IC Replacement Considerations

Public confirmed substitute part numbers: W988D6FBGX6I (Industrial temperature grade -40°C~85°C), W988D6FBGX7E (133MHz speed grade).