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WB0603TR13SG is listed in the Fixed Inductors range at ChipApex. The manufacturer field lists Cal-Chip Electronics, Inc.. Its product description is WW IND 0603 130NH 2%. Review the specifications below when checking this part for your BOM.
WB0603TR13SG is a surface-mount device (SMD) resistor manufactured by Cal-Chip Electronics, Inc. The component belongs to the standard 0603 package series designed for automated assembly processes. It functions as a passive electronic component intended for integration into printed circuit boards. The part number structure indicates specific physical dimensions and packaging configuration suitable for high-volume manufacturing environments.
Verify the manufacturer designation against official Cal-Chip Electronics documentation to confirm authenticity. Ensure the ordering suffix matches the required tape and reel specifications for automated handling. Cross-reference the full part number with authorized distributor catalogs to validate current availability status and compliance with relevant industry standards before finalizing procurement orders.
Select this component based on the required 0603 footprint constraints and surface-mount compatibility. Confirm that the electrical characteristics align with the target circuit design requirements. Evaluate supply chain reliability through authorized channels to ensure consistent quality levels. Consider volume packaging options to match production line automation capabilities effectively.
Cal-Chip Electronics, Inc. operates as a supplier of passive electronic components with a focus on surface-mounted devices. The company emphasizes quality excellence and zero-defect product delivery. This specific resistor model represents their standard offering for general electronic applications requiring reliable passive components in compact form factors.
Consult official manufacturer substitution guides for verified equivalent part numbers. Generic cross-references may not guarantee identical performance characteristics or physical tolerances. Verify compatibility with existing assembly processes before implementing alternative components.
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