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WB1008T3R9SJ is listed in the Fixed Inductors range at ChipApex. The manufacturer field lists Cal-Chip Electronics, Inc.. Its product description is WW IND 1008 3900NH 5%. Review the specifications below when checking this part for your BOM.
The WB1008T3R9SJ is a fixed surface-mount inductor manufactured by Cal-Chip Electronics, Inc. It features an unshielded drum core design with wirewound construction. The component has an inductance of 3.9 µH and operates within the standard 1008 (2520 Metric) package dimensions. Key electrical specifications include a maximum DC resistance of 3.6 Ohms and a saturation current rating of 260 mA. The device is supplied in tape and reel packaging for automated assembly processes.
Verify the specific manufacturer part number against official Cal-Chip Electronics documentation to ensure authenticity. Confirm that the received components match the specified 1008 package size and electrical parameters. Check for any physical damage or contamination on the terminals before soldering. Ensure storage conditions comply with moisture sensitivity level requirements if applicable.
Select this component when a 3.9 µH inductance value is required in a 1008 SMD form factor. Consider the 260 mA saturation current limit for power handling requirements. The unshielded design may require layout considerations regarding magnetic field interference. Verify that the 3.6 Ohm DC resistance aligns with the circuit's efficiency targets.
This inductor belongs to the Cal-Chip Electronics fixed inductor family designed for surface-mount technology. It complements other values in the WB1008 series, offering consistent mechanical dimensions while varying electrical properties. The product line supports high-volume manufacturing through standardized tape and reel packaging options.
Direct substitutes must maintain the 3.9 µH inductance, 1008 package dimensions, and similar current ratings. Cross-reference with other manufacturers' 1008 series unshielded drum core inductors. Ensure compatibility with existing PCB footprints and reflow soldering profiles.
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