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WB1008T82NSJ is listed in the Fixed Inductors range at ChipApex. The manufacturer field lists Cal-Chip Electronics, Inc.. Its product description is WW IND 1008 82NH 5%. Review the specifications below when checking this part for your BOM.
The WB1008T82NSJ is a general purpose surface mount inductor manufactured by Cal-Chip Electronics, Inc. It features a ceramic core and a single-element construction designed for standard electronic applications. The component provides an inductance value of 0.082 µH with a tolerance of ±5%. It is housed in a 1008 package footprint, measuring approximately 2.79 mm in length and 2.00 mm in width. This fixed inductor is suitable for use in circuits requiring compact passive components.
Verify the specific manufacturer datasheet to confirm electrical characteristics and mechanical dimensions prior to procurement. Ensure that the ordering suffix matches the required tolerance and packaging specifications. Cross-reference the part number with official Cal-Chip Electronics documentation to validate availability and compliance status before finalizing purchase orders.
Select this component when a low-inductance, high-precision solution is required for space-constrained designs. The 1008 package offers a balance between current handling capability and minimal board area consumption. Consider the ±5% tolerance for applications demanding tighter impedance matching compared to standard general-purpose variants.
This inductor belongs to the broader category of surface mount passive components produced by Cal-Chip Electronics, Inc. The company specializes in manufacturing zero-defect products for the electronics industry. The WB series represents their range of ceramic-core inductors, which are engineered for reliability and consistent performance across various commercial and industrial environments.
Direct substitutes include other 1008 package inductors with identical 0.082 µH values and ±5% tolerance ratings from compatible manufacturers. Verify that alternative parts maintain the same physical footprint and electrical parameters to ensure seamless integration without redesigning the PCB layout.
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