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WBZ451PE-E is listed in the RF Transceiver Modules And Modems range at ChipApex. The manufacturer field lists Microchip Technology. Its product description is BLUETOOTH LOW ENERGY/ZIGBEE COMB. Review the specifications below when checking this part for your BOM.
The WBZ451PE-E is a multiprotocol wireless module from Microchip Technology, integrating Bluetooth Low Energy and IEEE 802.15.4 (Zigbee) capabilities. It operates at 2.4 GHz with a maximum output power of 12 dBm and a receiver sensitivity of -103 dBm. The module supports data rates up to 2 Mb/s and features an integrated PCB antenna. Powered by an ARM Cortex-M4 core, it includes 128 kB of RAM and 1 MB of flash memory. Operating voltage ranges from 1.9 V to 3.6 V, with an extended temperature range spanning -40°C to +125°C. Dimensions are 7 mm x 7 mm x 0.9 mm in a shielded SMD package.
Verify the specific suffix 'E' indicates the extended temperature grade (-40°C to +125°C) compared to standard variants. Confirm RoHS compliance status through official documentation prior to integration. Ensure PCB layout adheres to RF shielding requirements specified in the datasheet to maintain signal integrity and regulatory certification validity.
Select this module when both BLE and 802.15.4 support are required in a single compact form factor. The extended temperature range makes it suitable for industrial applications where ambient conditions exceed commercial limits. Consider the integrated PCB antenna if space constraints prevent external connector usage. Verify interface compatibility with host MCU via SPI, QSPI, or USART connections.
This component belongs to the WBZ45 family of wireless modules, which integrate PIC32CX-BZ2 series MCUs. These modules are designed for low-cost, high-performance wireless applications requiring certified RF performance. The family supports rapid prototyping through compatible development boards like the WBZ451 Curiosity board, facilitating software development and feature demonstration.
WBZ451PE-I serves as a commercial temperature variant (-40°C to +85°C). Cross-reference pinouts and firmware compatibility before substitution. Ensure thermal management strategies align with the selected module's operating temperature specifications.
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