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WIP201610S-1R0MLDG is listed in the Fixed Inductors range at ChipApex. The manufacturer field lists INPAQ Technology Co., Ltd. Its product description is POWER INDUCTOR 2016 1.0UH 20% DC. Review the specifications below when checking this part for your BOM.
The WIP201610S-1R0MLDG is a fixed shielded wirewound inductor manufactured by INPAQ Technology Co., Ltd. It features an 0806 (2016 Metric) surface-mount package with dimensions of 2.0mm x 1.6mm x 1.0mm maximum height. The component provides an inductance value of 1 µH with a tolerance of ±20%. It supports a saturation current of 3 A and exhibits a maximum DC resistance of 60 mΩ.
Verify the complete part number including suffixes to ensure correct packaging and specifications. Confirm that the 1 µH inductance and 3 A current ratings align with your circuit requirements. Check manufacturer documentation for specific storage and handling conditions related to the metal molding process.
Select this component when a compact shielded inductor is required for high-current DC/DC converters. The 0806 size offers a balance between current handling capability and board space efficiency. Ensure the operating frequency range matches the application needs, as wirewound types are typically used for lower frequencies compared to multilayer ceramic variants.
This component belongs to the WIP201610S series of metal molding power inductors from INPAQ Technology. The series is designed for computing, communication, and automotive electronics. These components utilize a specific molding technique to enhance thermal performance and mechanical stability compared to standard plastic-bonded inductors.
Direct substitutes must match the 1 µH inductance, 0806 package, and similar current ratings. Verify pin compatibility and thermal characteristics before substitution.
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