ChipApex | Global Electronic Components Supplier
SEARCH
Search Product
Search Post
— IC芯片 | 连接器 | 传感器 | 被动器件 —
Consult the customer manager about the wholesale price.
consultation hotline：86-132-6715-2157
email：[email protected]
Contact the product manager for consultation. One-stop consultation is available.
Do you want a lower wholesale price? Please send us your inquiry and we will reply immediately.
Product Detailed Parameters
- Description：WLAN7002HC
- Series：-
- Mfr：NXP USA Inc.
- Package：Tape & Reel (TR)
- Function：Switch
- Frequency：2.4GHz
- RF Type：802.11ac
- Secondary Attributes：3V ~ 4.8V Supply
- Mounting Type：Surface Mount
- Package / Case：40-BGA, WLCSP
- Supplier Device Package：40-WLCSP (1.63x1.53)
- Grade：-
- Qualification：-
Download product information
Overview
The WLAN7002HCZ is an integrated RF transceiver module designed for wireless local area network applications. It supports the IEEE 802.11ac standard, operating within the 5 GHz frequency band to deliver high-throughput connectivity. The component requires a supply voltage ranging from 3V to 4.8V and utilizes a surface-mount 40-BGA WLCSP package with dimensions of 1.63x1.53 mm. This compact form factor facilitates integration into space-constrained mobile devices and IoT hardware requiring robust Wi-Fi performance.
Feature Summary
- Supports IEEE 802.11ac (Wi-Fi 5) protocol standards
- Operates in the 5 GHz frequency spectrum
- Integrated RF transceiver architecture
- Compact 40-pin WLCSP surface mount packaging
Applications
- Mobile smartphones and tablets
- Internet of Things (IoT) gateways
- Wireless access points
- Embedded networking modules
Procurement Notes
Verify RoHS compliance status and confirm the specific suffix designation matches project requirements. Ensure the supplier provides original manufacturer documentation. Cross-reference the part number against NXP Semiconductors official databases to validate authenticity and current lifecycle status before finalizing procurement orders.
Selection Notes
Select this component when designing systems requiring 5 GHz Wi-Fi 5 connectivity with minimal board space. Consider the 40-BGA WLCSP footprint for layout constraints. Evaluate power consumption profiles against system battery life requirements. Confirm compatibility with host processor interfaces and antenna matching networks during the schematic design phase.
Part Context
This device belongs to the WLAN7002H series of RF solutions from NXP Semiconductors. The series targets high-performance wireless communication needs in consumer electronics. The HCZ variant specifically denotes the package type and compliance status within the broader product family lineup.
Replacement Considerations
WLAN7002CCZ is listed as a related compliant variant within the same product family. Verify pinout compatibility and electrical specifications before substituting.
