WT15PC

Overview

The AirBorn WT15PC is a rectangular MIL-Spec connector from the W Series, designed for board mount applications. It features a straight plug configuration with 15 positions arranged in two rows. The component utilizes solder cup termination for pin contacts and is constructed with a Polyphenylene Sulfide (PPS) shell. It complies with MIL-DTL-55302 standards, offering a 2.54 mm pitch and gold-plated copper alloy contacts rated for 5 A current and 1 kV voltage across an operating temperature range of -65 C to +125 C.

Feature Summary

• Complies with MIL-DTL-55302 military specifications for high reliability
• Features solder cup termination for secure wire attachment
• Utilizes corrosion-resistant gold plating on copper alloy contacts

Applications

• Military avionics systems
• Defense communication equipment
• Aerospace instrumentation panels

Procurement Notes

Verify the specific suffix against official Molex/AirBorn documentation to confirm exact contact orientation and hardware variations. Ensure compatibility with mating receptacles within the same W Series family. Confirm RoHS compliance status through the manufacturer's latest certification records before procurement.

Selection Notes

Select this part for rigid board-mounted interconnects requiring standardized MIL-DTL-55302 performance. The straight plug design suits panel or chassis mounting where cable entry is not required. Verify that the 15-position density meets circuit requirements and that the 2.54 mm pitch aligns with PCB layout constraints.

Part Context

This component belongs to the AirBorn W Series, which provides 0.100-inch pitch rectangular connectors. The series is widely used in commercial aerospace and defense sectors for its robust construction and consistent electrical performance under harsh environmental conditions.

Replacement Considerations

Cross-reference with M55302/xx-A15J equivalents. Verify that substitute parts maintain identical pinout configurations and mechanical dimensions to ensure direct interchangeability without redesigning the host assembly.