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WTB30SAD9JTB is listed in the Headers, Receptacles, Female Sockets range at ChipApex. The manufacturer field lists AirBorn, a Molex company. Its product description is WTB30SAD9JTB. Review the specifications below when checking this part for your BOM.
The WTB30SAD9JTB is a rectangular MIL-DTL-55302 series board mount receptacle from the AirBorn W Series. It features 30 positions arranged in a dual-row configuration with a 2.54 mm pitch. The connector utilizes through-hole termination and socket contacts made of copper alloy with gold plating. Constructed with a polyphenylene sulfide (PPS) plastic body, it supports a current rating of 5 A per contact. The unit operates within a temperature range of -65°C to +125°C and includes mounting ears for secure installation.
Verify the specific ordering suffix against the manufacturer datasheet to ensure compatibility with required tail length and jackset dimensions. Confirm that the PPS material grade meets environmental exposure requirements. Cross-reference the MIL-DTL-55302 revision level to guarantee adherence to current regulatory standards for defense applications.
Select this component when a straight, dual-row receptacle with through-hole mounting is required. Ensure the 2.54 mm pitch aligns with the PCB layout constraints. Verify that the 5 A current rating and -65°C to +125°C operating range satisfy the thermal and electrical demands of the target circuit design without derating issues.
This part belongs to the AirBorn W Series, a line of rectangular connectors designed for high-reliability environments. The series is characterized by its compliance with stringent military standards and robust construction materials. The WTB30SAD9JTB specifically addresses applications requiring dense I/O connections with secure board-mounting capabilities in harsh conditions.
Direct substitutes include parts sharing the M55302/58-B30F designation or equivalent MIL-DTL-55302 compliant receptacles with identical 30-position, dual-row, through-hole specifications. Verify pinout and mechanical envelope compatibility before substitution.
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