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WTBV30PD9JTA is listed in the Headers, Male Pins range at ChipApex. The manufacturer field lists AirBorn, a Molex company. Its product description is WTBV30PD9JTA. Review the specifications below when checking this part for your BOM.
The WTBV30PD9JTA is a rectangular MIL-Spec connector from the AirBorn W Series, designed for board mount applications. It features a straight plug configuration with 30 positions arranged in two rows. The component utilizes through-hole termination with gold-plated copper alloy pin contacts and a polyphenylene sulfide (PPS) body. It complies with MIL-DTL-55302 standards, offering a 2.54 mm pitch, 5 A current rating, and 1 kV voltage rating. Operating temperatures range from -65 °C to +125 °C.
Verify the specific manufacturer part number against official Molex/AirBorn documentation to ensure compliance with MIL-DTL-55302 requirements. Confirm that the through-hole termination and straight plug orientation match the design constraints. Validate material specifications, including PPS housing and gold plating, against project standards before integration.
Select this component when a MIL-DTL-55302 compliant rectangular connector is required for board-mounted applications. Ensure the 30-position, dual-row layout fits the PCB footprint. Verify that the 2.54 mm pitch and through-hole termination method align with manufacturing capabilities. Confirm environmental ratings meet the operational temperature range of -65 °C to +125 °C.
This part belongs to the AirBorn W Series, a line of rectangular connectors engineered for demanding environments. The series offers various contact counts and termination options, maintaining consistent MIL-DTL-55302 performance. The WTBV30PD9JTA represents a standard straight plug variant within this family, providing robust connectivity for critical electronic assemblies.
M55302/63B30H is a confirmed public substitute part number for this component. Verify mechanical dimensions and electrical characteristics against the original specification before substitution.
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