WTDXA30SJT

Overview

The AirBorn WTDXA30SJT is a rectangular MIL Spec connector receptacle from the W Series. It features 30 positions arranged in two rows with a 2.54 mm pitch. Designed for PCB mount, it utilizes crimp termination for 22 AWG wires. The contacts are gold-plated copper alloy sockets rated for 5 A current. Constructed with Polyphenylene Sulfide (PPS) housing, it operates between -65 C and +125 C with an insulation resistance of 5 GOhms.

Feature Summary

• Military-grade rectangular connector design compliant with MIL-DTL-55302 standards
• Gold-plated copper alloy socket contacts ensure reliable signal transmission
• Polyphenylene Sulfide housing provides thermal stability and durability

Applications

• Avionics systems requiring rugged interconnects
• Military communication equipment
• Industrial control panels

Procurement Notes

Verify the specific suffix against official Molex/AirBorn documentation to confirm exact contact plating thickness and environmental sealing ratings. Ensure compatibility with mating plugs within the same W Series family. Confirm RoHS compliance status through the manufacturer's certificate of conformity prior to integration into regulated assemblies.

Selection Notes

Select this component when a straight, 30-position receptacle is required for high-density PCB mounting. The 2.54 mm pitch suits standard wire gauges like 22 AWG. Consider the operating temperature range and current rating relative to the system's electrical load and environmental exposure requirements.

Part Context

This part belongs to the AirBorn W Series, a line of rectangular connectors designed for demanding environments. The series offers various position counts and mounting styles, maintaining consistent interface dimensions across the family for interchangeability within military and aerospace applications.

Replacement Considerations

Compatible substitutes include other W Series receptacles such as WTDXA20SJTB or WTDXA40SJTB if position count adjustments are permissible. Verify mechanical footprint and pinout alignment before substitution.