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The X3C14P1-03S is a surface-mount 90-degree hybrid coupler manufactured by TTM Technologies. It operates within a frequency range of 1.2 GHz to 1.7 GHz and features a maximum insertion loss of 0.2 dB. The component utilizes SMD/SMT termination for board mounting applications. It is designed for signal conditioning in RF systems, supporting frequencies from 1200 MHz to 1700 MHz with high precision coupling characteristics.
Verify the specific datasheet version for the X3C14P1-03S to confirm exact electrical tolerances and thermal specifications before integration. Ensure that the PCB footprint matches the manufacturer's recommended land pattern for reliable SMD soldering. Cross-reference the RoHS compliance status with current regulatory requirements for your target market.
Select this component when a compact 90-degree phase shift is required between 1.2 GHz and 1.7 GHz. Its low insertion loss makes it suitable for sensitive RF paths where signal integrity is critical. Consider the surface-mount package for automated assembly processes and space-constrained designs.
This part belongs to the Xinger III series of RF components from TTM Technologies. These components are engineered for high reliability in demanding environments. The X3C14P1-03S specifically addresses needs for precise power splitting and combining in microwave applications.
Check for direct substitutes within the Xinger III family or other 90-degree hybrid couplers covering the 1.2-1.7 GHz range. Verify pinout compatibility and impedance matching if replacing with non-TTM parts.