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The X3DC08E2S is a Doherty Combiner manufactured by TTM Technologies, designed for surface-mount device (SMD) integration. It operates within the frequency range of 862 MHz to 894 MHz and supports a power rating of 200 W. The component belongs to the Xinger III series and utilizes a 4-SMD, no-lead package configuration. This RF combiner is engineered for high-power applications requiring precise signal combining in wireless communication systems.
Verify RoHS compliance status through official manufacturer documentation before procurement. Confirm that the 12-week standard lead time aligns with production schedules. Ensure the 4-SMD no-lead package matches PCB footprint requirements. Validate that the 200 W power rating meets system thermal and electrical specifications. Check for any recent packaging changes via product change notices.
Select this component when designing Doherty amplifier architectures requiring a 200 W combiner. Ensure the operating frequency falls strictly between 862 MHz and 894 MHz. Verify compatibility with SMD assembly processes due to the no-lead package. Consider thermal management capabilities required for continuous 200 W operation. Confirm impedance matching requirements for the specific application bandwidth.
The X3DC08E2S is part of TTM Technologies' Xinger III series, which focuses on advanced RF components for demanding applications. As a Doherty Combiner, it serves as a critical passive element in high-efficiency power amplification stages. The component bridges the gap between individual amplifier outputs and the final load, enabling improved efficiency in wireless transmission systems.
No public confirmed substitute part numbers are available in the provided documentation. Direct replacement requires identical Doherty combiner specifications, including 200 W power handling and the 862-894 MHz frequency range. Any alternative must match the 4-SMD no-lead package dimensions and electrical performance characteristics.