X3DC18E2S

X3DC18E2S

$4.98
  • Description:DOHERTY COMBINR 1805-1880MHZ SMD
  • Series:Xinger III®
  • Mfr:TTM Technologies, Inc.
  • Package:Tape & Reel (TR),Cut Tape (CT)

SKU:1f1c077fccc6 Category: Brand:

  
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Product Detailed Parameters

  • Description:DOHERTY COMBINR 1805-1880MHZ SMD
  • Series:Xinger III®
  • Mfr:TTM Technologies, Inc.
  • Package:Tape & Reel (TR),Cut Tape (CT)
  • Function:Doherty Combiner
  • Frequency:1.805GHz ~ 1.88GHz
  • RF Type:General Purpose
  • Secondary Attributes:200W
  • Mounting Type:Surface Mount
  • Package / Case:4-SMD, No Lead
  • Supplier Device Package:SMD
  • Grade:-
  • Qualification:-

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X3DC18E2S

Overview

The X3DC18E2S is a general-purpose RF IC Doherty combiner manufactured by TTM Technologies. Designed for surface-mount installation, this component operates within the frequency range of 1.805 GHz to 1.88 GHz. It supports a power rating of 200 W and utilizes an SMD package configuration. The device is part of the Xinger III series and is suitable for high-power RF applications requiring signal combining functionality.

Feature Summary

  • Integrates Doherty combining architecture for RF signal processing
  • Supports high-power operation up to 200 W
  • Optimized for surface-mount technology (SMD) board integration

Applications

  • RF amplifier systems utilizing Doherty topology
  • Base station transmitter modules
  • Wireless communication infrastructure equipment

Procurement Notes

Verify the specific operating frequency range against your system requirements, as the component is rated for 1.805 GHz to 1.88 GHz. Confirm that the 200 W power handling capability aligns with your design's peak power demands. Ensure compatibility with the specified SMD footprint during PCB layout. Check for any updated material declarations or RoHS compliance documentation prior to final procurement approval.

Selection Notes

Select this component when a general-purpose Doherty combiner is required for frequencies near 1.8 GHz. The 200 W power rating makes it suitable for high-output applications. Consider the SMD package type for automated assembly processes. Evaluate thermal management needs based on the power dissipation characteristics inherent to Doherty combiners in this power class.

Part Context

This component belongs to the Xinger III series from TTM Technologies, which focuses on advanced RF and microwave components. The X3DC18E2S serves as a specialized integrated module for combining RF signals in high-power amplifier architectures. It represents TTM's capability in providing compact, high-performance solutions for wireless infrastructure markets.

Replacement Considerations

Publicly confirmed substitute part numbers are not available in the provided source data. Verify pinout and electrical specifications carefully if considering alternative manufacturers' Doherty combiners for the same frequency band.

X3DC18E2SX3DC18E2S
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