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The X3DC21E2S is a Doherty combiner from the Xinger III series by TTM Technologies, Inc. Designed for surface mount applications, this RF component operates within a frequency range of 2.11GHz to 2.17GHz. It supports a maximum power handling capacity of 200W and utilizes a 4-SMD, no-lead package. The device is classified as a general-purpose RF IC suitable for high-efficiency signal combining in wireless infrastructure.
Verify the specific ordering suffix against the manufacturer datasheet to ensure correct packaging configuration. Confirm that the required lead time aligns with project schedules, as standard delivery may extend beyond typical immediate availability. Ensure compatibility with the intended PCB footprint and thermal management requirements before finalizing procurement orders.
Select this component when a compact, high-power Doherty solution is required for the 2.11GHz to 2.17GHz band. Consider the 200W power rating and SMD form factor for space-constrained designs. Evaluate thermal dissipation needs relative to the 4-SMD package size and ensure the application matches the general-purpose RF classification.
This part belongs to the Xinger III series, which focuses on passive and active RF components for modern wireless standards. The X3DC21E2S specifically addresses the need for efficient power combining in cellular and broadband sectors, offering a reliable alternative to discrete combiner networks while maintaining high linearity and efficiency.
Consult the official TTM Technologies cross-reference documentation for verified substitute part numbers. Do not assume functional equivalence with other Xinger models without verifying pinout, power ratings, and frequency specifications against the original datasheet.