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The X60008EIS8-50 is a precision 5.0V voltage reference utilizing Intersil's proprietary Floating Gate Analog (FGA) technology, designed for high accuracy and ultra-low power consumption. It features an absolute initial accuracy of ±5mV at 25°C and a maximum temperature coefficient of 20ppm/°C over the industrial range (-40°C to +85°C). The device operates with a supply voltage between 5.1V and 9.0V while drawing only 500nA typical supply current. It provides 10mA source and sink current capability with a very low dropout voltage of 100mV at no load. Long-term stability is rated at 10ppm per 1000 hours.
Verify component authenticity through authorized channels as the device is manufactured by Intersil Americas Inc. Confirm package integrity and pin configuration matches the SOIC-8 standard before integration. Ensure handling procedures account for electrostatic discharge sensitivity. Validate that the specific ordering suffix corresponds to the required accuracy grade and temperature range specifications.
Select this component when designing systems requiring high precision with minimal power budget constraints. The FGA technology offers advantages over traditional bandgap references regarding temperature stability and noise performance. Consider the 7ms turn-on time during system initialization planning. Evaluate board mounting locations to minimize mechanical stress effects on accuracy, preferably near board edges.
This part belongs to the X60008 series of precision voltage references developed by Intersil. The series leverages floating gate CMOS processes to deliver high accuracy and low drift. The X60008EIS8-50 specifically denotes the 5.000V output variant with ±5mV accuracy and industrial temperature rating. It serves as a foundational reference element for analog signal chains in industrial and portable applications.
Direct replacements must match the 5.0V output, SOIC-8 package, and similar low-power specifications. Verify compatibility with existing PCB footprints and thermal requirements. Note that alternative technologies may exhibit different turn-on times and noise profiles compared to the FGA architecture.
The FGA technology allows for a generally flat temperature coefficient curve across the industrial range, minimizing drift variations compared to the 's-curve' behavior often seen in bandgap devices.
For load capacitances above 0.001µF, a noise reduction network using a 0.01µF capacitor, a 10µF capacitor, and a 2kΩ resistor is recommended to significantly reduce noise across the full bandwidth.
Placing the device in areas subject to twisting or bending can cause die stresses that degrade accuracy. It is best placed near the edge of the board where bending axis limits are minimized.