X66AK2H06AAAW2

Overview

The X66AK2H06AAAW2 is a Texas Instruments multicore System-on-Chip (SoC) based on the KeyStone II architecture. It integrates six TMS320C66x DSP cores and two ARM Cortex-A15 processors within a single package. The device operates with maximum clock frequencies of 1.2 GHz for the DSP cores and 1.4 GHz for the ARM cores. It features 6 MB of data RAM, 32 kB L1 instruction memory, and 32 kB L1 data memory per core. The component utilizes a 1517-pin FCBGA package and supports an operating temperature range from -40°C to +100°C.

Feature Summary

• Six C66x DSP cores running at up to 1.2 GHz
• Dual ARM Cortex-A15 cores running at up to 1.4 GHz
• KeyStone II interconnect architecture
• Integrated 6 MB data RAM

Applications

• Software-defined radio base stations
• Advanced radar signal processing systems
• Medical imaging equipment

Procurement Notes

Verify the specific suffix 'WA2' against official Texas Instruments documentation to confirm pinout compatibility and electrical characteristics. Ensure that the ordering information matches the exact part number required for the design, as suffixes often denote package variations or temperature grades.

Selection Notes

Select this SoC when high-throughput parallel processing is required alongside complex control tasks. The combination of C66x DSPs and ARM cores allows for efficient distribution of computational loads. Verify that the system power supply can support the specified voltage rails and current requirements for both processor domains.

Part Context

This component belongs to the 66AK2H06 family of KeyStone II devices. It serves as a high-performance solution for applications demanding significant digital signal processing capabilities integrated with general-purpose computing resources in a compact form factor.

Replacement Considerations

Consult the Texas Instruments product migration guide for verified substitutes. Potential alternatives within the same family include the 66AK2H06DAAW2, which shares similar core configurations but may differ in specific interface options or packaging details.