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X9250UV24IZ-2.7T2 is listed in the Digital Potentiometers range at ChipApex. The manufacturer field lists Renesas Electronics Corporation. Its product description is IC DGT POT 50KOHM 256TAP 24TSSOP. Review the specifications below when checking this part for your BOM.
The X9250UV24IZ-2.7T2 is a quad digitally controlled potentiometer (XDCP) from Renesas Electronics, part of the X9250 series. It integrates four independent potentiometers on a single monolithic CMOS IC, each featuring 256 resistor taps for precise adjustment. The device utilizes a serial SPI interface for control and includes nonvolatile memory to retain wiper positions during power loss. It operates within a supply voltage range of 2.7V to 5.5V and is housed in a 24-pin TSSOP package.
Verify the specific suffix 'T2' against official Renesas documentation to confirm tape-and-reel packaging specifications and quantity per reel. Ensure compatibility with standard SPI bus timing requirements. Check for RoHS compliance status as indicated in the latest datasheet revision. Confirm availability through authorized distributors given potential lifecycle changes.
Select this component when four independent digital pots are required in a compact surface-mount package. The SPI interface is suitable for microcontrollers with limited GPIO pins. Consider the 256-tap resolution for applications requiring fine adjustment. Verify that the 2.7V minimum supply voltage meets the system's power rail constraints.
The X9250UV24IZ-2.7T2 belongs to the X9250 family of quad XDCPs. This series is designed to replace mechanical potentiometers in applications requiring digital control and nonvolatile storage. The UV24 designation indicates a 24-pin TSSOP package variant. The -2.7 suffix typically denotes the minimum operating supply voltage capability.
Direct pin-to-pin replacements may include other X9250 variants with different resistance values (e.g., 50kΩ vs 100kΩ) or interface types. Verify that substitute components support the same SPI protocol and nonvolatile memory architecture. Cross-reference package dimensions and thermal characteristics if replacing in an existing design.
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