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XA3S1600E-4FGG484I is listed in the Field Programmable Gate Array range at ChipApex. The manufacturer field lists AMD. Its product description is IC FPGA 376 I/O 484FBGA. Review the specifications below when checking this part for your BOM.
The XA3S1600E-4FGG484I is an automotive-grade Field Programmable Gate Array (FPGA) from the AMD Spartan-3E XA family. It features 1,600,000 system gates and 3,688 Logic Blocks within a 400-ball FineLine BGA package measuring 21x21 mm. The device supports up to 304 I/O pins and includes 663,552 total RAM bits. Operating voltage ranges from 1.14V to 1.26V, with a junction temperature range of -40°C to 125°C. It holds AEC-Q100 qualification for automotive reliability.
Verify component authenticity through authorized AMD distributors or certified partners. Confirm the specific suffix indicates the correct package and temperature grade. Check for End-of-Life notices as availability may be limited. Ensure compliance with RoHS directives for environmental regulations. Request full datasheets and quality certificates before finalizing procurement decisions.
Compare against other Spartan-3E variants based on gate count and I/O requirements. Consider power consumption differences between standard and low-power versions. Evaluate package options if board space constraints exist. Verify thermal management capabilities for the target operating environment. Assess compatibility with existing programming tools and development software.
This component belongs to the Spartan-3E XA family, designed specifically for automotive applications requiring robust performance and reliability. It builds upon the standard Spartan-3E architecture with enhanced features suitable for harsh environments. The series offers a balance of cost-effectiveness and functionality for mid-range logic designs.
Direct substitutes include other XA3S1600 variants with different speed grades or packages. Cross-reference with Microchip PolarFire or IGloo2 families for lower power alternatives. Verify pin-to-pin compatibility when considering physical replacements. Ensure functional equivalence in terms of logic density and memory capacity.
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