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XAZU1EG-L1SFVA625I is listed in the Soc System On Chip range at ChipApex. The manufacturer field lists AMD. Its product description is ZUP MPSOC A53 FPGA Q LP 625BGA. Review the specifications below when checking this part for your BOM.
The XAZU1EG-L1SFVA625I is a System on Chip (SoC) FPGA from the Zynq UltraScale+ MPSoC EG series, manufactured by AMD. It integrates an ARM Cortex-A53 application processor subsystem with an ARM Cortex-R5 real-time subsystem and an ARM Mali-400 MP2 graphics processing unit alongside programmable logic. The device features over 154,000 logic cells within the FPGA fabric. It operates at clock speeds of up to 500 MHz for the A53 cores and 1.2 GHz for the R5 cores. The component is housed in a 625-ball FCBGA package measuring 21x21 mm and supports a junction temperature range of -40°C to 100°C.
Verify the specific suffix L1 against official AMD documentation to confirm voltage domains and speed grades. Confirm availability status as distribution channels may list this part as out of stock or on backorder. Ensure the 625-FCBGA footprint matches the target PCB design constraints before ordering.
Select this model when a balance of moderate FPGA resources and embedded processing power is required. Compare against higher-capacity models like the XAZU3EG if additional logic cells are needed. Verify that the 154K+ logic cell count suffices for the intended hardware implementation without requiring external configuration memory bandwidth bottlenecks.
This component belongs to the Zynq UltraScale+ MPSoC family, specifically the EG variant designed for embedded general-purpose applications. It sits below higher-density models in the product hierarchy while offering significant integration compared to standard SoCs. The EG series targets cost-sensitive embedded markets requiring mixed-signal programmability.
Direct pin-compatible replacements within the same package include other variants of the XAZU1EG series with different speed grades or temperature ranges. Cross-family migration to the Zynq 7000 series requires significant schematic and software redesign due to architectural differences.
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