XAZU3EG-1SFVA625Q

Soc System On Chip Overview

The XAZU3EG-1SFVA625Q is an automotive-grade System on Chip (SoC) FPGA from the AMD Xilinx Zynq UltraScale+ MPSoC EG family. It integrates a quad-core ARM Cortex-A53 application processing unit and a dual-core ARM Cortex-R5 real-time processing unit with programmable logic featuring over 154,000 logic cells. The device supports CPU frequencies up to 1.2 GHz for the APU and 500 MHz for the RPU. It includes 1.8 MB of embedded RAM and an ARM Mali-400 MP2 GPU. The component utilizes a 625-pin FCBGA package and operates within a junction temperature range of -40°C to +125°C.

Soc System On Chip Feature Summary

• Automotive-grade reliability certified under AEC-Q100 standards
• Heterogeneous architecture combining ARM processors with Xilinx programmable logic
• Integrated multimedia processing capabilities via embedded GPU

Soc System On Chip Applications

• Automotive digital cockpit systems
• Advanced driver assistance systems (ADAS)
• Industrial automation controllers

Soc System On Chip Procurement Notes

Verify the specific suffix 'Q' confirms AEC-Q100 automotive qualification during sourcing. Ensure the ordering information matches the exact 625-pin FCBGA package dimensions. Confirm that the intended operating environment aligns with the specified industrial/automotive temperature ratings before finalizing procurement.

Soc System On Chip Selection Notes

Select this model when automotive certification is mandatory for the target deployment. Compare against the 'I' variant if environmental qualification requirements differ. Evaluate the 154K+ logic cell capacity against design complexity needs. Verify power consumption profiles against thermal management constraints in the final enclosure.

Soc System On Chip Part Context

This part belongs to the Zynq UltraScale+ MPSoC EG series, designed specifically for embedded applications requiring high performance and low power. The 'XA' prefix denotes the extended temperature and automotive-grade manufacturing process. It shares the core silicon architecture with other EG variants but differs in qualification standards and packaging options.

Soc System On Chip Replacement Considerations

The XAZU3EG-1SFVA625I serves as a functional equivalent with identical electrical specifications, differing only in its industrial temperature qualification rather than automotive certification. Direct substitution requires verifying that the lower qualification tier meets the specific system requirements.