XAZU7EV-1FBVB900I

Soc System On Chip Overview

The AMD XAZU7EV-1FBVB900I is a Zynq UltraScale+ RFSoC device belonging to the entry-level EV series. It integrates dual ARM Cortex-A53 application processors, a Cortex-R5 real-time processor, and programmable logic featuring analog-to-digital converters (ADCs) and digital-to-analog converters (DACs). The device utilizes a 900-ball FCBGA package with a 1.2mm ball pitch. Key specifications include 2.6 million logic cells, 8.4 megabits of block RAM, and support for high-speed serial interfaces. This SoC is designed for applications requiring combined processing, control, and high-speed data conversion capabilities within a single silicon die.

Soc System On Chip Feature Summary

• Integrates heterogeneous processing system with ARM Cortex-A53 and Cortex-R5 cores alongside RF-capable programmable logic
• Includes on-chip high-speed analog-to-digital and digital-to-analog converters for direct RF signal interfacing
• Supports secure boot and hardware-based encryption through integrated security engines

Soc System On Chip Applications

• Software-defined radio (SDR) systems
• Test and measurement instrumentation
• Wireless infrastructure base stations

Soc System On Chip Procurement Notes

Verify the specific suffix 'I' indicates industrial temperature range compliance. Confirm the package type matches the 900-ball FCBGA requirement for your PCB layout. Ensure the selected Vivado version supports the Zynq UltraScale+ MPSoC architecture for proper bitstream generation and IP integration.

Soc System On Chip Selection Notes

Select this model when analog conversion density is required alongside general-purpose processing. Compare against higher-tier models if additional logic resources or faster transceiver speeds are needed. Verify power supply requirements and thermal management solutions suitable for the FCBGA package constraints.

Soc System On Chip Part Context

This component is part of the Zynq UltraScale+ RFSoC family, specifically the Entry Value (EV) tier. It differs from standard MPSoC devices by embedding high-speed ADCs and DACs directly within the FPGA fabric. The EV series offers a balance of performance and cost for applications that do not require the maximum resource counts found in the XS or XF series.

Soc System On Chip Replacement Considerations

• XAZU7EV-1FFVB900I
• XAZU9EV-1FFVB900I

Soc System On Chip FAQ

What is the logic capacity of the XAZU7EV?

The device contains 2.6 million logic cells available for user implementation.

Does this part include embedded memory?

Yes, it integrates 8.4 megabits of block RAM for data storage and buffering.