Configuration PROMs For FPGAs XC1701LPD8C product image

XC1701LPD8C

  • Description:IC 1 MB 3.3V SER CONF PROM 8-DIP
  • Series:-
  • Mfr:AMD
  • Package:Tube

SKU:0e2e87fb6b08 Category: Brand:

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XC1701LPD8C is listed in the Configuration PROMs For FPGAs range at ChipApex. The manufacturer field lists AMD. Its product description is IC 1 MB 3.3V SER CONF PROM 8-DIP. Review the specifications below when checking this part for your BOM.

Configuration PROMs For FPGAs specifications for XC1701LPD8C

  • Description:IC 1 MB 3.3V SER CONF PROM 8-DIP
  • Series:-
  • Mfr:AMD
  • Package:Tube
  • Programmable Type:OTP
  • Memory Size:1Mb
  • Voltage - Supply:3V ~ 3.6V
  • Operating Temperature:0°C ~ 70°C
  • Mounting Type:Through Hole
  • Package / Case:8-DIP (0.300", 7.62mm)
  • Supplier Device Package:8-PDIP

Configuration PROMs For FPGAs datasheet and documents for XC1701LPD8C

XC1701LPD8C

Configuration PROMs For FPGAs Overview

The XC1701LPD8C is a one-time programmable (OTP) configuration PROM designed for Field Programmable Gate Array (FPGA) systems. Manufactured by AMD, this integrated circuit provides 1 MB of storage capacity and operates at a standard 3.3V supply voltage. It is housed in an 8-pin Dual In-line Package (DIP), facilitating straightforward integration into legacy or specific industrial hardware designs requiring non-volatile configuration data storage.

Configuration PROMs For FPGAs Feature Summary

  • Provides non-volatile storage for FPGA configuration bitstreams
  • Supports 3.3V logic levels for system compatibility
  • Utilizes OTP technology for secure, permanent data retention

Configuration PROMs For FPGAs Applications

  • FPGA initialization and configuration
  • Industrial control systems requiring persistent settings
  • Embedded hardware design

Configuration PROMs For FPGAs Procurement Notes

Verify the exact package type and voltage requirements against your schematic before ordering. Confirm that the application environment supports one-time programming constraints, as data cannot be altered after fabrication. Ensure the supplier provides genuine AMD components to guarantee reliability and specification compliance.

Configuration PROMs For FPGAs Selection Notes

Select this component when a small-capacity, low-pin-count solution is needed for FPGA boot configurations. The DIP package is suitable for prototyping or applications where surface-mount space is not a constraint. Consider the 1 MB limit to ensure it accommodates the required firmware size without needing larger alternatives.

Configuration PROMs For FPGAs Part Context

This part belongs to AMD's lineup of configuration memory devices used primarily with their FPGA products. These PROMs serve as the primary source for loading device-specific logic structures upon power-up, ensuring the FPGA initializes correctly according to the stored design parameters.

Configuration PROMs For FPGAs Replacement Considerations

Check for compatible OTP PROMs from other manufacturers with matching pin counts and voltage ratings. Verify electrical characteristics such as access time and hold current to ensure seamless replacement without circuit modification.

XC1701LPD8CXC1701LPD8C

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