XC17256ELPC20C

Configuration PROMs For FPGAs Overview

The XC17256ELPC20C is a configuration memory device manufactured by AMD (Xilinx), designed for storing configuration bitstreams of Xilinx FPGAs. It features a 256Kx1 organization with a total memory density of 262,144 bits. The component operates in synchronous mode with a maximum clock frequency of 10 MHz and utilizes 3-state outputs. It is housed in a 20-pin Plastic Quad Flat Package (PQCC) with LCC-20 footprint, measuring 8.9662 mm in length. The device supports a common I/O type and complies with JESD-30 and JESD-609 standards.

Configuration PROMs For FPGAs Feature Summary

• Stores configuration bitstreams for Xilinx FPGAs
• Synchronous operation with 3-state outputs
• Plastic LCC-20 package

Configuration PROMs For FPGAs Applications

• Configuration storage for Xilinx FPGAs

Configuration PROMs For FPGAs Procurement Notes

Verify the RoHS compliance status, as documentation indicates non-compliance. Confirm the moisture sensitivity level is rated at Level 3. Ensure the ordering suffix matches the specific plastic LCC-20 package variant. Check for any lead-free plating specifications required by your assembly process. Validate that the 10 MHz maximum clock frequency meets your system timing requirements before procurement.

Configuration PROMs For FPGAs Selection Notes

Select this component when configuring Xilinx FPGAs requiring a 256Kx1 configuration memory interface. Consider the synchronous operation mode and 10 MHz clock limit for timing compatibility. Evaluate the PQCC20 package dimensions against your PCB layout constraints. Verify that the 3-state output characteristics align with your bus architecture. Ensure the operating temperature range up to 70 °C suits your environmental conditions.

Configuration PROMs For FPGAs Part Context

This part belongs to the Xilinx configuration memory family, now under AMD. These devices are essential for booting and configuring Xilinx programmable logic devices. They provide non-volatile storage for the FPGA bitstream data. The product line supports various densities and package options to fit different design constraints. AMD continues to support these components for legacy and ongoing embedded systems.

Configuration PROMs For FPGAs Replacement Considerations

Check for direct pin-compatible alternatives within the Xilinx configuration memory portfolio. Verify if newer density options offer backward compatibility. Confirm package dimensions and electrical characteristics match exactly. Review AMD's obsolescence notices for this specific part number.