XC18V512SOG20C

Overview

The XC18V512SOG20C is a 512Kb (64K x 8) In-System Programmable (ISP) Configuration PROM designed for Xilinx FPGAs. It operates at a supply voltage of 2.7V to 3.6V and features a 20-SOIC package. The device supports serial configuration data loading, enabling FPGA setup without external host processors. It offers high reliability with industrial temperature range options and includes built-in error detection mechanisms such as CRC checking to ensure configuration integrity during the programming process.

Feature Summary

• Supports In-System Programming for flexible field updates
• Integrated CRC error detection for configuration verification
• Serial interface reduces pin count and board space

Applications

• Configuration of Xilinx Spartan-II and Virtex FPGAs
• Industrial control systems requiring reliable FPGA initialization
• Telecommunications equipment needing in-field programmability

Procurement Notes

Verify component authenticity through authorized distributors due to obsolete status. Confirm package variant matches SOIC-20 specifications. Check revision history for any documented errata affecting ISP functionality. Ensure storage conditions comply with moisture sensitivity levels prior to reflow soldering processes.

Selection Notes

Select this part when 512Kb capacity suffices for target FPGA bitstream size. Consider alternative densities if larger configurations are required. Evaluate thermal requirements against industrial grade specifications. Verify compatibility with specific Xilinx device families supported by the XC18V series architecture.

Part Context

Part of the XC18V family of configuration PROMs from AMD/Xilinx. Designed specifically for configuring SRAM-based FPGAs. Replaced by newer generation configuration devices offering higher densities and faster speeds. Remains relevant for legacy system maintenance and repair scenarios.

Replacement Considerations

XC18V512VOG20C is a verified equivalent variant within the same family. Both share identical electrical characteristics and pinouts. Verify package suffix consistency when sourcing substitutes. Cross-reference with official AMD replacement guides for discontinued components.