XC2C256-6VQ100C

Complex Programmable Logic Devices Overview

The XC2C256-6VQ100C is a CoolRunner-II CPLD manufactured by AMD. It features 256 macrocells, 16 Adaptive Logic Modules (ALMs), and 80 I/Os in a 100-pin VQFP package. The device operates at a supply voltage of 1.7V to 1.9V with a maximum propagation delay of 6.7ns. It supports system-in-programmability and functions within a commercial temperature range of 0°C to 70°C.

Complex Programmable Logic Devices Feature Summary

• 256 Macrocells with 16 ALMs for complex logic implementation
• System-in-programmable capability for flexible updates
• 100-VQFP surface-mount package with 80 I/Os
• Low power consumption with 1.8V nominal operation

Complex Programmable Logic Devices Applications

• Logic level translation
• Bus bridging
• Address decoding
• Simple state machine control

Complex Programmable Logic Devices Procurement Notes

This component is listed as discontinued or end-of-life by the manufacturer. Verification of current availability requires checking authorized distributors for remaining stock or valid replacement alternatives. Ensure compliance with RoHS3 specifications if required for the application.

Complex Programmable Logic Devices Selection Notes

Select this part for designs requiring moderate logic density with low pin counts. Verify that the 100-VQFP package fits the PCB footprint constraints. Confirm that the 6.7ns speed grade meets the timing requirements of the target circuit. Consider the 0°C to 70°C operating temperature range against environmental conditions.

Complex Programmable Logic Devices Part Context

Part of the CoolRunner-II family, designed for low-power, high-density CPLD applications. It bridges the gap between simple gate arrays and more complex FPGAs, offering deterministic timing and non-volatile configuration without external memory.

Complex Programmable Logic Devices Replacement Considerations

Verify pin-to-pin compatibility with alternative CPLDs from other manufacturers such as Lattice or Microchip. Check for equivalent macrocell counts and I/O configurations. Ensure voltage levels and package dimensions match the existing design constraints.