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XC2C512-7FT256I is listed in the Complex Programmable Logic Devices range at ChipApex. The manufacturer field lists AMD. Its product description is IC CPLD 512MC 7.1NS 256FTBGA. Review the specifications below when checking this part for your BOM.
The XC2C512-7FT256I is a CoolRunner-II CPLD manufactured by AMD, featuring 512 macrocells and 24 logic blocks within a 256-pin FineLine BGA package. It supports system-in-programmability (SIP) for flexible field updates. The device operates with an internal supply voltage range of 1.7V to 1.9V and delivers a maximum propagation delay of 7.1 ns. Designed for commercial applications, it functions reliably within a temperature range of 0°C to 70°C.
Verify the specific suffix 'I' indicates the industrial temperature grade variant if required, though standard datasheets often list commercial ranges. Confirm RoHS compliance status through official AMD documentation or authorized distributors, as environmental declarations may vary by production batch. Check for End-of-Life (EOL) notices or Product Change Notifications (PCN) regarding availability and long-term supply commitments.
Select this component when 512 macrocells are sufficient for the design complexity and a 256-pin footprint is available on the PCB. Ensure the design requires the 7ns speed grade for timing closure. Verify that the 1.8V core voltage aligns with the system's power architecture. Consider the FTBGA package constraints for thermal management and routing density compared to TQFP alternatives.
This part belongs to the AMD CoolRunner-II family of Complex Programmable Logic Devices. The series is characterized by low power consumption and non-volatile configuration memory. The XC2C512 represents a mid-range density option within the family, offering a balance between logic capacity and pin count suitable for moderate complexity embedded control tasks.
Direct pin-to-pin replacements within the same package and speed grade should be verified against AMD's current product portfolio. Cross-family migration to newer architectures may require schematic and layout modifications due to differences in I/O standards and power requirements.
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