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XC2S200-6FG456C is listed in the Field Programmable Gate Array range at ChipApex. The manufacturer field lists AMD. Its product description is IC FPGA 284 I/O 456FBGA. Review the specifications below when checking this part for your BOM.
The XC2S200-6FGG456C is a Field Programmable Gate Array (FPGA) belonging to the Spartan-II family, manufactured by Xilinx. It features 192 I/O pins and utilizes a 456-pin FineLine BGA package with a 0.8 mm pitch. The device operates at a maximum system clock frequency of 166 MHz under the -6 speed grade. Key internal resources include 200,000 system gates, 12,288 logic cells, and 36 Kbits of embedded Block RAM. It supports up to 18 DSP slices for arithmetic operations.
Verify the exact suffix designation, as datasheets typically list XC2S200E rather than XC2S200. Confirm the package type matches the 456-ball FineLine BGA specification. Ensure the speed grade corresponds to the required timing constraints for your specific design application before finalizing procurement orders.
Select this component when designing systems requiring moderate logic density with established toolchain support. Verify compatibility with legacy development environments such as Xilinx ISE if migrating older designs. Consider power consumption limits and thermal dissipation requirements associated with the BGA package form factor during board layout planning.
This part belongs to the Spartan-II FPGA family, representing an earlier generation of programmable logic technology. While superseded by newer architectures like Spartan-3 and later series, it remains relevant for maintaining legacy systems or specific cost-sensitive applications requiring proven reliability and extensive historical documentation.
Direct pin-to-pin replacements are not available due to architectural differences. Migration paths typically involve upgrading to Spartan-3E or Spartan-6 families, which require significant schematic and code modifications. Consult official migration guides for resource mapping and feature parity analysis.
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