Field Programmable Gate Array XC3S1000-4FG456I product image

XC3S1000-4FG456I

$180.12
  • Description:IC FPGA 333 I/O 456FBGA
  • Series:Spartan®-3

SKU:d4f4ac1709c9 Category: Brand:

  
  • Quantity
    • -
    • +
  •    
ChipApex WhatsApp

Consult the customer manager about the wholesale price.

consultation hotline:86-132-6715-2157

email:[email protected]
Contact the product manager for consultation. One-stop consultation is available.


Do you want a lower wholesale price? Please send us your inquiry and we will reply immediately.

Submitting!
Submission successful!
Submission failed!
Email error!
Phone number error!

XC3S1000-4FG456I is listed in the Field Programmable Gate Array range at ChipApex. The manufacturer field lists AMD. Its product description is IC FPGA 333 I/O 456FBGA. Review the specifications below when checking this part for your BOM.

Field Programmable Gate Array specifications for XC3S1000-4FG456I

  • Description:IC FPGA 333 I/O 456FBGA
  • Series:Spartan®-3
  • Mfr:AMD
  • Package:Tray
  • Number of LABs/CLBs:1920
  • Number of Logic Elements/Cells:17280
  • Total RAM Bits:442368
  • Number of I/O:333
  • Voltage - Supply:1.14V ~ 1.26V
  • Mounting Type:Surface Mount
  • Operating Temperature:-40°C ~ 100°C (TJ)
  • Package / Case:456-BBGA
  • Supplier Device Package:456-FBGA (23x23)
  • Number of Gates:1000000
  • Grade:-
  • Qualification:-

Field Programmable Gate Array datasheet and documents for XC3S1000-4FG456I

XC3S1000-4FG456I

Field Programmable Gate Array Overview

The XC3S1000-4FG456I is an SRAM-based Field Programmable Gate Array (FPGA) belonging to the Spartan-3 family, manufactured by AMD (formerly Xilinx). It features a logic capacity of approximately 17,280 equivalent logic cells organized into 1,920 Configurable Logic Blocks (CLBs). The device operates with a core voltage range of 1.14V to 1.26V and supports up to 333 user I/Os within a 456-ball FineLine BGA package. Key resources include 442,368 bits of embedded block RAM and distributed RAM, along with dedicated digital clock manager (DCM) units for clock synthesis and phase shifting. The -4 speed grade indicates a maximum system clock frequency performance suitable for moderate-speed applications.

Field Programmable Gate Array Feature Summary

  • SRAM-based architecture enabling in-system reconfiguration and flexible logic implementation.
  • Integrated Digital Clock Manager (DCM) resources for precise clock distribution and phase control.
  • High-density embedded memory blocks supporting complex data buffering and storage requirements.
  • Support for multiple I/O standards including LVCMOS, LVTTL, and differential signaling interfaces.

Field Programmable Gate Array Applications

  • Industrial control systems requiring programmable logic for automation and monitoring.
  • Consumer electronics involving display driving and interface bridging.
  • Network infrastructure equipment utilizing protocol processing and packet handling.
  • Embedded systems needing glue logic or peripheral acceleration.

Field Programmable Gate Array Procurement Notes

Verify the specific suffix 'I' denotes industrial temperature range compliance (-40°C to +85°C) against official AMD datasheets. Confirm package integrity and moisture sensitivity level (MSL) ratings prior to assembly. Ensure sourcing channels provide traceability to original manufacturer documentation to avoid counterfeit components. Cross-reference part numbers with current AMD product lifecycle status to confirm availability and support longevity.

Field Programmable Gate Array Selection Notes

Select this component when design requirements align with the Spartan-3 logic density and I/O count. Evaluate power consumption profiles considering the 1.2V core supply and I/O voltage levels. Compare against newer Spartan-3A or Artix families if enhanced performance or lower power is critical. Verify that existing design tools, such as older ISE versions, remain compatible with the target development environment.

Field Programmable Gate Array Part Context

This model is part of the broader Spartan-3 FPGA portfolio, positioned as a cost-effective solution for medium-complexity designs. It shares architectural similarities with other XC3S1000 variants but differs in package type and speed grade. The FBGA-456 package offers higher pin counts compared to smaller packages like FG320, facilitating more extensive I/O connectivity for complex board layouts.

Field Programmable Gate Array Replacement Considerations

Direct functional replacements may include other XC3S1000 variants with different speed grades or packages, such as XC3S1000-4FGG320I, provided pin compatibility is verified. For upgraded performance, consider Spartan-3A series devices like XC3S1000A, though pinouts and resource distributions may vary. Always consult AMD migration guides for architectural differences between generations.

XC3S1000-4FG456IXC3S1000-4FG456I
$180.12
Buy Now