Field Programmable Gate Array XC3S1000-4FGG456C product image

XC3S1000-4FGG456C

  • Description:IC FPGA 333 I/O 456FBGA
  • Series:Spartan®-3

SKU:eeb2c43e88b7 Category: Brand:

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XC3S1000-4FGG456C is listed in the Field Programmable Gate Array range at ChipApex. The manufacturer field lists AMD. Its product description is IC FPGA 333 I/O 456FBGA. Review the specifications below when checking this part for your BOM.

Field Programmable Gate Array specifications for XC3S1000-4FGG456C

  • Description:IC FPGA 333 I/O 456FBGA
  • Series:Spartan®-3
  • Mfr:AMD
  • Package:Tray
  • Number of LABs/CLBs:1920
  • Number of Logic Elements/Cells:17280
  • Total RAM Bits:442368
  • Number of I/O:333
  • Voltage - Supply:1.14V ~ 1.26V
  • Mounting Type:Surface Mount
  • Operating Temperature:0°C ~ 85°C (TJ)
  • Package / Case:456-BBGA
  • Supplier Device Package:456-FBGA (23x23)
  • Number of Gates:1000000
  • Grade:-
  • Qualification:-

Field Programmable Gate Array datasheet and documents for XC3S1000-4FGG456C

XC3S1000-4FGG456C

Field Programmable Gate Array Overview

The XC3S1000-4FGG456C is a Spartan-3 family SRAM-based FPGA featuring 17,280 logic cells and 1,920 LABs/CLBs. It utilizes a 456-ball Fine-Pitch Ball Grid Array (FPBGA) package with 333 user I/Os. The device operates at a -4 speed grade with a maximum system frequency of 500 MHz. Key resources include 442,368 bits of embedded block RAM and 216 Kb of distributed RAM. Power specifications require a 1.2V core supply (1.14V–1.26V range) and typically 3.3V for I/O banks. The commercial temperature range is 0°C to 85°C.

Field Programmable Gate Array Feature Summary

  • High-density programmable logic architecture supporting complex state machines and arithmetic operations
  • Integrated clock management tools for precise phase shifting and frequency synthesis
  • Flexible configuration options via parallel or serial PROM interfaces
  • Support for multiple I/O standards including LVCMOS and LVTTL

Field Programmable Gate Array Applications

  • Industrial automation control systems
  • Video processing and display frontends
  • Network interface bridging and protocol conversion
  • Embedded logic acceleration in consumer electronics

Field Programmable Gate Array Procurement Notes

Verify the specific suffix 'C' indicates commercial temperature rating against official AMD documentation. Confirm package integrity and moisture sensitivity level prior to assembly. Ensure compatibility with legacy ISE design tools for bitstream generation. Check for RoHS compliance status as per current manufacturing standards.

Field Programmable Gate Array Selection Notes

Select this model when moderate logic density and high I/O count are required within a cost-sensitive embedded application. Compare against XC3S1000 variants with different speed grades if timing constraints allow. Consider the 456-pin footprint constraints during PCB layout planning. Evaluate power consumption profiles relative to available thermal dissipation solutions.

Field Programmable Gate Array Part Context

This component belongs to the Xilinx Spartan-3 series, now managed by AMD. It represents a mid-range capacity device designed for volume production environments. The part bridges the gap between lower-end CPLDs and higher-performance Virtex families. It serves as a foundational platform for general-purpose digital logic implementation.

Field Programmable Gate Array Replacement Considerations

Direct pin-compatible replacements may not exist due to architectural differences. Consider XC3S1000A for enhanced performance or XC3S500 for reduced cost if logic requirements permit. Verify software toolchain support for any alternative Spartan-3 variants before substitution.

XC3S1000-4FGG456CXC3S1000-4FGG456C

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