XC3S1200E-4FG400I

Field Programmable Gate Array Overview

The AMD XC3S1200E-4FG400I is a field-programmable gate array belonging to the Spartan-3E family, designed for cost-sensitive embedded applications. It utilizes a 90 nm process technology and features approximately 1,228,800 system gates with 67,584 logic cells. The device integrates 3,456 Kbit of Block RAM and supports up to 324 user I/O pins within a 400-pin FineLine BGA package. Operating at a maximum frequency of 400 MHz (speed grade -4), it functions at a typical supply voltage of 1.2V, offering high performance for glue logic, interface bridging, and signal processing tasks.

Field Programmable Gate Array Feature Summary

• High-density logic architecture optimized for complex digital designs
• Integrated Block RAM resources for efficient data buffering and queue management
• Support for multiple I/O standards including LVCMOS and differential signaling
• Flexible configuration options via serial flash or JTAG programming

Field Programmable Gate Array Applications

• Glue logic replacement in mixed-signal systems
• Interface bridging between disparate protocol domains
• Low-to-medium speed data acquisition systems
• Small-scale digital signal processing implementations

Field Programmable Gate Array Procurement Notes

Verify the manufacturer source carefully as this component belongs to an end-of-life product family. Confirm that the specific speed grade (-4) and package type (FG400) match your design requirements. Ensure availability of compatible configuration memory devices if using external flash for non-volatile storage. Check for RoHS compliance status relative to your manufacturing regulations.

Field Programmable Gate Array Selection Notes

Select this part when moderate logic density is required alongside significant on-chip memory resources. The FG400 package provides ample I/O count for peripheral connectivity but requires surface-mount assembly capabilities. Consider thermal dissipation characteristics inherent to the BGA form factor during PCB layout. Evaluate power consumption against available cooling solutions for enclosed enclosures.

Field Programmable Gate Array Part Context

This component is part of the broader Spartan-3E FPGA portfolio, which serves as a bridge between entry-level and high-performance programmable logic families. It shares architectural similarities with other 90 nm Spartan devices but offers higher resource counts than smaller variants like the XC3S500E. The family is known for balancing cost efficiency with sufficient performance for industrial and consumer electronics applications.

Field Programmable Gate Array Replacement Considerations

Direct pin-compatible replacements are not available due to architectural differences. Potential alternatives include the Xilinx Spartan-6 series or Intel Cyclone IV/III families, though these require schematic and layout modifications. Verify software toolchain compatibility when migrating to newer FPGA architectures.