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XC3S200AN-4FT256C is listed in the Field Programmable Gate Array range at ChipApex. The manufacturer field lists AMD. Its product description is IC FPGA 195 I/O 256FTBGA. Review the specifications below when checking this part for your BOM.
The XC3S200AN-4FT256C is an industrial-grade Field Programmable Gate Array (FPGA) from AMD's Spartan-3A family. It features 217,600 system gates and supports up to 280 I/O pins within a 256-pin FineLine BGA package. The device operates with a minimum logic block delay of 4.0 ns at the -4 speed grade. Key specifications include 1.5 Mbits of embedded Block RAM, support for JTAG boundary scan, and compatibility with standard 3.3V I/O standards. It is designed for robust performance in demanding industrial environments.
Verify the specific suffix codes against official AMD documentation to confirm package type, speed grade, and temperature rating. Ensure that the procurement channel provides valid traceability for industrial-grade components. Cross-reference the full part number with current datasheets to confirm availability and any potential obsolescence notices before finalizing orders.
Select this component when industrial environmental stability is required alongside moderate FPGA density. Compare resource utilization against the standard Spartan-3A series to determine if the AN variant's industrial rating is necessary. Evaluate pin count requirements against the FT256 package limitations to ensure adequate I/O flexibility for the target design.
This model belongs to the Spartan-3A family, which succeeded the original Spartan-3 line by offering enhanced performance and lower power consumption. The AN designation specifically indicates industrial temperature grading, distinguishing it from commercial variants. It serves as a bridge between low-cost entry-level FPGAs and higher-end Virtex devices, providing a balance of cost and capability.
Direct replacements may include other Spartan-3A variants with adjusted speed grades or package sizes. Verify pin-to-pin compatibility when substituting models with different package footprints. Consider newer Artix families for improved power efficiency if legacy support is not strictly required.
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