Field Programmable Gate Array XC3S5000-4FGG676I product image

XC3S5000-4FGG676I

$279.57
  • Description:IC FPGA 489 I/O 676FBGA
  • Series:Spartan®-3

SKU:0d5acd185e43 Category: Brand:

  
  • Quantity
    • -
    • +
  •    
ChipApex WhatsApp

Consult the customer manager about the wholesale price.

consultation hotline:86-132-6715-2157

email:[email protected]
Contact the product manager for consultation. One-stop consultation is available.


Do you want a lower wholesale price? Please send us your inquiry and we will reply immediately.

Submitting!
Submission successful!
Submission failed!
Email error!
Phone number error!

XC3S5000-4FGG676I is listed in the Field Programmable Gate Array range at ChipApex. The manufacturer field lists AMD. Its product description is IC FPGA 489 I/O 676FBGA. Review the specifications below when checking this part for your BOM.

Field Programmable Gate Array specifications for XC3S5000-4FGG676I

  • Description:IC FPGA 489 I/O 676FBGA
  • Series:Spartan®-3
  • Mfr:AMD
  • Package:Tray
  • Number of LABs/CLBs:8320
  • Number of Logic Elements/Cells:74880
  • Total RAM Bits:1916928
  • Number of I/O:489
  • Voltage - Supply:1.14V ~ 1.26V
  • Mounting Type:Surface Mount
  • Operating Temperature:-40°C ~ 100°C (TJ)
  • Package / Case:676-BGA
  • Supplier Device Package:676-FBGA (27x27)
  • Number of Gates:5000000
  • Grade:-
  • Qualification:-

Field Programmable Gate Array datasheet and documents for XC3S5000-4FGG676I

XC3S5000-4FGG676I

Field Programmable Gate Array Overview

The XC3S5000-4FGG676I is a high-capacity SRAM-based Field Programmable Gate Array (FPGA) belonging to the Spartan-3 family manufactured by AMD. It features 5,000,000 system gates and 8,320 Configurable Logic Blocks (CLBs). The device provides 489 user I/Os within a 676-ball FineLine BGA package measuring 27x27 mm. It operates with a core voltage range of 1.14V to 1.26V and supports a junction temperature range of 0°C to 85°C. Total block RAM capacity reaches 1,916,928 bits, supporting complex digital logic implementations.

Field Programmable Gate Array Feature Summary

  • High-density logic architecture with over five million system gates for complex designs
  • Integrated extensive on-chip memory resources totaling nearly two megabits
  • Supports multiple I/O standards via 489 available input/output pins
  • Utilizes SRAM technology allowing for in-system reprogrammability

Field Programmable Gate Array Applications

  • Industrial automation control systems
  • Consumer electronics logic processing
  • Network interface bridging
  • Video signal processing front-ends

Field Programmable Gate Array Procurement Notes

Verify component authenticity through authorized distributors as this part may be discontinued. Confirm RoHS compliance status and check for moisture sensitivity level requirements during storage. Ensure supply chain stability due to potential obsolescence. Validate package dimensions against existing PCB footprints before ordering.

Field Programmable Gate Array Selection Notes

Compare total gate counts and I/O availability against design requirements. Evaluate power consumption profiles relative to the 1.2V core voltage specification. Consider thermal management needs for the 676-ball FBGA package. Assess compatibility with legacy configuration tools such as Xilinx ISE if applicable.

Field Programmable Gate Array Part Context

This component belongs to the Spartan-3 FPGA family, designed for cost-sensitive embedded applications requiring moderate to high logic density. It serves as an intermediate solution between smaller Spartan devices and larger Virtex families, balancing performance with manufacturing affordability for mass-market electronic products.

Field Programmable Gate Array Replacement Considerations

Publicly confirmed substitute part numbers include LFE5U-85F-6BG756C from Lattice Semiconductor and T55F576C3 from Efinix. Verify pinout compatibility and logic resource equivalence before substitution.

XC3S5000-4FGG676IXC3S5000-4FGG676I
$279.57
Buy Now