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XC3S5000-4FGG676I is listed in the Field Programmable Gate Array range at ChipApex. The manufacturer field lists AMD. Its product description is IC FPGA 489 I/O 676FBGA. Review the specifications below when checking this part for your BOM.
The XC3S5000-4FGG676I is a high-capacity SRAM-based Field Programmable Gate Array (FPGA) belonging to the Spartan-3 family manufactured by AMD. It features 5,000,000 system gates and 8,320 Configurable Logic Blocks (CLBs). The device provides 489 user I/Os within a 676-ball FineLine BGA package measuring 27x27 mm. It operates with a core voltage range of 1.14V to 1.26V and supports a junction temperature range of 0°C to 85°C. Total block RAM capacity reaches 1,916,928 bits, supporting complex digital logic implementations.
Verify component authenticity through authorized distributors as this part may be discontinued. Confirm RoHS compliance status and check for moisture sensitivity level requirements during storage. Ensure supply chain stability due to potential obsolescence. Validate package dimensions against existing PCB footprints before ordering.
Compare total gate counts and I/O availability against design requirements. Evaluate power consumption profiles relative to the 1.2V core voltage specification. Consider thermal management needs for the 676-ball FBGA package. Assess compatibility with legacy configuration tools such as Xilinx ISE if applicable.
This component belongs to the Spartan-3 FPGA family, designed for cost-sensitive embedded applications requiring moderate to high logic density. It serves as an intermediate solution between smaller Spartan devices and larger Virtex families, balancing performance with manufacturing affordability for mass-market electronic products.
Publicly confirmed substitute part numbers include LFE5U-85F-6BG756C from Lattice Semiconductor and T55F576C3 from Efinix. Verify pinout compatibility and logic resource equivalence before substitution.
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