Field Programmable Gate Array XC3S50AN-4FTG256C product image

XC3S50AN-4FTG256C

  • Description:IC FPGA 195 I/O 256FTBGA
  • Series:Spartan®-3AN

SKU:c676a8427d48 Category: Brand:

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XC3S50AN-4FTG256C is listed in the Field Programmable Gate Array range at ChipApex. The manufacturer field lists AMD. Its product description is IC FPGA 195 I/O 256FTBGA. Review the specifications below when checking this part for your BOM.

Field Programmable Gate Array specifications for XC3S50AN-4FTG256C

  • Description:IC FPGA 195 I/O 256FTBGA
  • Series:Spartan®-3AN
  • Mfr:AMD
  • Package:Tray
  • Number of LABs/CLBs:176
  • Number of Logic Elements/Cells:1584
  • Total RAM Bits:55296
  • Number of I/O:195
  • Voltage - Supply:1.14V ~ 1.26V
  • Mounting Type:Surface Mount
  • Operating Temperature:0°C ~ 85°C (TJ)
  • Package / Case:256-LBGA
  • Supplier Device Package:256-FTBGA (17x17)
  • Number of Gates:50000
  • Grade:-
  • Qualification:-

Field Programmable Gate Array datasheet and documents for XC3S50AN-4FTG256C

XC3S50AN-4FTG256C

Field Programmable Gate Array Overview

The XC3S50AN-4FTG256C is a Field Programmable Gate Array (FPGA) belonging to the Spartan-3AN family, manufactured by AMD. It features 128 Logic Blocks providing 1152 logic elements and 72 Kbits of embedded block RAM. The device supports up to 195 user I/Os and operates within an industrial temperature range of -40°C to +85°C. Key electrical parameters include a core voltage of 1.14V to 1.26V and a maximum operating frequency of 280 MHz. It is housed in a 256-pin FineLine BGA package with a 17mm x 17mm footprint.

Field Programmable Gate Array Feature Summary

  • Integrated SPI flash configuration capability for standalone system operation without external configuration memory
  • Supports low-power design methodologies through power-down modes and dynamic clock management
  • Provides high-density programmable logic with flexible I/O standards for diverse interface requirements

Field Programmable Gate Array Applications

  • Industrial control systems requiring reliable programmable logic
  • Consumer electronics utilizing SPI flash configuration
  • Telecommunications infrastructure components
  • Test and measurement equipment interfaces

Field Programmable Gate Array Procurement Notes

Verify component authenticity through authorized distributors due to end-of-life status. Confirm package integrity and pin compatibility during acquisition. Review official discontinuation notices for supply chain planning. Ensure storage conditions meet moisture sensitivity level requirements prior to assembly.

Field Programmable Gate Array Selection Notes

Evaluate logic resource requirements against the 1152 available logic elements. Verify I/O count needs do not exceed 195 pins. Check voltage domain compatibility with the 1.2V core requirement. Consider thermal performance within the specified industrial temperature range for long-term reliability.

Field Programmable Gate Array Part Context

This component is part of the Spartan-3AN series, which integrates onboard SPI flash configuration. It succeeds earlier Spartan-3 devices by offering simplified system designs. The family targets cost-sensitive applications requiring moderate logic density and flexible configuration options.

Field Programmable Gate Array Replacement Considerations

Publicly confirmed substitute part numbers are not available in verified documentation. Consult AMD official resources for current lifecycle status and potential obsolescence management strategies.

XC3S50AN-4FTG256CXC3S50AN-4FTG256C

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