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XC3S50AN-4FTG256C is listed in the Field Programmable Gate Array range at ChipApex. The manufacturer field lists AMD. Its product description is IC FPGA 195 I/O 256FTBGA. Review the specifications below when checking this part for your BOM.
The XC3S50AN-4FTG256C is a Field Programmable Gate Array (FPGA) belonging to the Spartan-3AN family, manufactured by AMD. It features 128 Logic Blocks providing 1152 logic elements and 72 Kbits of embedded block RAM. The device supports up to 195 user I/Os and operates within an industrial temperature range of -40°C to +85°C. Key electrical parameters include a core voltage of 1.14V to 1.26V and a maximum operating frequency of 280 MHz. It is housed in a 256-pin FineLine BGA package with a 17mm x 17mm footprint.
Verify component authenticity through authorized distributors due to end-of-life status. Confirm package integrity and pin compatibility during acquisition. Review official discontinuation notices for supply chain planning. Ensure storage conditions meet moisture sensitivity level requirements prior to assembly.
Evaluate logic resource requirements against the 1152 available logic elements. Verify I/O count needs do not exceed 195 pins. Check voltage domain compatibility with the 1.2V core requirement. Consider thermal performance within the specified industrial temperature range for long-term reliability.
This component is part of the Spartan-3AN series, which integrates onboard SPI flash configuration. It succeeds earlier Spartan-3 devices by offering simplified system designs. The family targets cost-sensitive applications requiring moderate logic density and flexible configuration options.
Publicly confirmed substitute part numbers are not available in verified documentation. Consult AMD official resources for current lifecycle status and potential obsolescence management strategies.
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