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XC6SLX45-N3FGG676C is listed in the Field Programmable Gate Array range at ChipApex. The manufacturer field lists AMD. Its product description is IC FPGA 358 I/O 676FBGA. Review the specifications below when checking this part for your BOM.
The XC6SLX45-N3FGG676C is a Spartan-6 LX series Field Programmable Gate Array manufactured by AMD. It features 43,661 logic elements and 3,411 Logic Array Blocks within a 676-pin FBGA package. The device integrates 2,088 Kbit of embedded memory and supports up to 358 I/O pins. Operating at a core voltage of 1.14V to 1.26V, it functions within a commercial temperature range of 0°C to +85°C. Key specifications include a maximum data rate of 800 Mb/s for I/O and support for high-speed serial transceivers.
Verify the specific suffix N3 against official AMD documentation to confirm the speed grade and commercial temperature rating. Ensure the 676-FBGA footprint matches the target PCB design. Confirm RoHS compliance status through current manufacturer declarations prior to procurement.
Select this model when moderate logic density and integrated DSP capabilities are required without the cost of higher-tier Virtex devices. Compare resource utilization against the XC6SLX75 if additional logic or memory capacity is anticipated. Verify that the 676-pin package fits the available board space and thermal constraints.
This component belongs to the AMD Spartan-6 LX family, designed for cost-sensitive applications requiring high performance. It bridges the gap between smaller CPLDs and larger FPGAs, offering a balance of logic resources, embedded memory, and specialized blocks like DSP and PCIe endpoints for versatile system integration.
Direct pin-compatible replacements within the same package are limited due to specific speed grades. Consider the XC6SLX45-3FGG676C for industrial temperature ranges or other Spartan-6 variants if logic density requirements change. Validate timing closure and resource availability before substituting.
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