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XC7K325T-3FBG676E is listed in the Field Programmable Gate Array range at ChipApex. The manufacturer field lists AMD. Its product description is IC FPGA 400 I/O 676FCBGA. Review the specifications below when checking this part for your BOM.
The XC7K325T-3FBG676E is a Kintex-7 Field Programmable Gate Array (FPGA) manufactured by AMD. It utilizes a 28nm high-performance low-power (HPL) process technology and features 326,080 logic elements and 50,950 adaptive logic modules (ALMs). The device includes 15.64 Mbit of embedded memory and supports up to 400 user I/Os. It operates within an extended industrial temperature range of -55°C to +100°C. The FPGA integrates eight GTX transceivers capable of data rates up to 6.6 Gb/s and supports maximum operating frequencies of 640 MHz. It is housed in a 676-ball FCBGA package.
Verify the specific speed grade suffix '3' against official AMD documentation to confirm performance characteristics. Ensure the 'E' suffix correctly denotes the extended industrial temperature range required for your application environment. Cross-reference the package type with design constraints before ordering.
Select this model when extended temperature stability is critical. Compare resource utilization against the -1 and -2 speed grades if higher clock speeds are not required. Verify that the available I/O count meets interface requirements for the target system architecture.
This component belongs to the Kintex-7 family, which targets cost-sensitive applications requiring significant logic density. The XC7K325T variant offers a balance between capacity and power consumption. The FBG676 package provides a compact footprint suitable for space-constrained board layouts.
Direct substitutes include other XC7K325T variants with different speed grades or packages. Verify pin compatibility and thermal specifications when considering alternatives from the same family.
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