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XC7K410T-3FBG900E is listed in the Field Programmable Gate Array range at ChipApex. The manufacturer field lists AMD. Its product description is IC FPGA 500 I/O 900FCBGA. Review the specifications below when checking this part for your BOM.
The XC7K410T-3FBG900E is a Kintex-7 Field Programmable Gate Array manufactured by AMD. It features 406,720 logic elements and 63,550 adaptive logic modules within an FCBGA-900 package. The device includes 27.95 Mbit of embedded memory and supports up to 500 I/Os. It operates with supply voltages ranging from 1.2 V to 3.3 V and functions within a temperature range of -40°C to +100°C. The component utilizes sixteen transceivers capable of data rates up to 6.6 Gb/s.
Verify the specific suffix codes against official AMD documentation to confirm electrical grade and temperature rating. Ensure compatibility with existing board designs regarding pinout and power requirements before procurement. Confirm availability through authorized distribution channels to guarantee component authenticity and traceability.
Select this model when design requirements exceed the capacity of lower-tier Kintex-7 devices but do not necessitate Virtex-7 density. Evaluate the trade-off between the -3 speed grade performance and cost relative to system timing constraints. Consider thermal management solutions suitable for the FCBGA-900 package form factor during the initial hardware planning phase.
This component belongs to the AMD Kintex-7 family, targeting mid-to-high-end applications requiring significant logic density and high-speed connectivity. It serves as a scalable solution within the broader Xilinx portfolio, bridging the gap between entry-level Artix-7 devices and high-end Virtex-7 architectures for complex digital logic implementations.
Direct functional replacements within the same package and pinout are limited. Designers may consider other Kintex-7 variants with different speed grades or package types if physical footprint changes are permissible. Cross-family migration to newer UltraScale or UltraScale+ devices requires substantial schematic and layout modifications.
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