XC7WT14GD,125

Overview

The XC7WT14GD,125 is a logic inverter manufactured by Nexperia. It contains eight independent inverting circuits within a single package. The device operates with a supply voltage range from -500 mV to 7 V. It features a propagation delay of 11 ns. The component is housed in an XSON-8 surface-mount package. It supports installation via SMD/SMT techniques. The operational temperature range extends from -40 C to +125 C.

Feature Summary

• Contains eight independent inverting channels for signal inversion.
• Supports wide supply voltage operation down to near zero volts.
• Includes I_OFF circuitry to prevent backflow current during partial power-down states.

Applications

• Signal inversion in digital logic circuits
• Clock signal conditioning
• Level shifting between different voltage domains

Procurement Notes

Verify the specific ordering code and suffix carefully, as variations exist within the product family. Confirm availability status directly with the manufacturer or authorized distributors, as this item may be subject to production end-of-life notices. Ensure the selected package type matches the PCB footprint requirements before finalizing procurement decisions.

Selection Notes

Select this component when high channel density is required in a minimal footprint. The wide voltage range allows compatibility with various low-voltage logic families. Verify that the thermal performance of the XSON-8 package meets the application's heat dissipation needs under maximum operating conditions.

Part Context

This part belongs to the Nexperia XC7W series of wide-voltage inverters. The series is designed for applications requiring robust signal inversion across varying supply levels. The GD suffix indicates the specific XSON-8 packaging configuration used for this variant.

Replacement Considerations

Check for direct pin-compatible alternatives within the same Nexperia family. Verify that any substitute maintains the eight-channel configuration and similar propagation delay characteristics. Ensure the replacement package matches the existing board layout constraints.