Soc System On Chip XC7Z030-1FFG676I product image

XC7Z030-1FFG676I

$398.91
  • Description:IC SOC CORTEX-A9 667MHZ 676FCBGA
  • Series:Zynq®-7000

SKU:db7e4719d1a1 Category: Brand:

  
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XC7Z030-1FFG676I is listed in the Soc System On Chip range at ChipApex. The manufacturer field lists AMD. Its product description is IC SOC CORTEX-A9 667MHZ 676FCBGA. Review the specifications below when checking this part for your BOM.

Soc System On Chip specifications for XC7Z030-1FFG676I

  • Description:IC SOC CORTEX-A9 667MHZ 676FCBGA
  • Series:Zynq®-7000
  • Mfr:AMD
  • Package:Tray
  • Architecture:MCU, FPGA
  • Core Processor:Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
  • Flash Size:-
  • RAM Size:256KB
  • Peripherals:DMA
  • Connectivity:CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
  • Speed:667MHz
  • Primary Attributes:Kintex™-7 FPGA, 125K Logic Cells
  • Operating Temperature:-40°C ~ 100°C (TJ)
  • Grade:-
  • Qualification:-
  • Package / Case:676-BBGA, FCBGA
  • Supplier Device Package:676-FCBGA (27x27)

Soc System On Chip datasheet and documents for XC7Z030-1FFG676I

XC7Z030-1FFG676I

Soc System On Chip Overview

The XC7Z030-1FFG676I is a Zynq-7000 All Programmable System-on-Chip (SoC) manufactured by AMD. It integrates a dual-core ARM Cortex-A9 MPCore processing system with a Kintex-7 FPGA fabric on a single die. The device operates at a maximum processor frequency of 800 MHz and contains approximately 125,000 logic cells within the programmable logic section. It utilizes a 676-pin Flip Chip Ball Grid Array (FCBGA) package with dimensions of 27x27 mm. The component supports industrial temperature ranges and includes extensive memory resources such as Block RAM and DSP slices for high-performance computing tasks.

Soc System On Chip Feature Summary

  • Integrates dual-core ARM Cortex-A9 processors with Kintex-7 FPGA fabric for heterogeneous computing
  • Supports high-speed peripheral interfaces including USB OTG, Ethernet MAC, and SD/SDIO controllers
  • Features AXI interconnect architecture enabling low-latency data exchange between processing and programmable systems

Soc System On Chip Applications

  • Industrial automation and control systems requiring real-time processing
  • Medical imaging equipment and diagnostic devices
  • Wireless infrastructure and baseband processing units

Soc System On Chip Procurement Notes

Verify the specific speed grade suffix to ensure compatibility with timing requirements. Confirm that the FCBGA-676 footprint matches the target PCB design constraints. Check for moisture sensitivity level ratings to determine proper storage and reflow soldering profiles. Ensure supply chain authenticity through authorized distributors to avoid counterfeit components.

Soc System On Chip Selection Notes

Select this model when a balance between processing power and logic capacity is required. The -1 speed grade offers higher performance than -2 or -3 variants but may have stricter timing constraints. Consider thermal management solutions due to the high integration density. Evaluate memory interface requirements against the available PS peripherals before finalizing the design.

Soc System On Chip Part Context

This component belongs to the Zynq-7000 family, which bridges the gap between traditional microprocessors and FPGAs. It allows developers to run operating systems on the ARM cores while offloading computationally intensive tasks to the FPGA fabric. This architecture reduces system complexity by eliminating the need for separate processor and logic chips.

Soc System On Chip Replacement Considerations

XC7Z030-2FFG676I: Lower speed grade variant with identical pinout and functionality. XC7Z030-L2FBG676I: Low-power variant suitable for energy-constrained applications. XC7Z035-1FFG676I: Higher capacity alternative with increased logic resources.

XC7Z030-1FFG676IXC7Z030-1FFG676I
$398.91
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