Soc System On Chip XC7Z030-3FBG484E product image

XC7Z030-3FBG484E

$382.33
  • Description:IC SOC CORTEX-A9 1GHZ 484FCBGA
  • Series:Zynq®-7000

SKU:cf74040a8953 Category: Brand:

  
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XC7Z030-3FBG484E is listed in the Soc System On Chip range at ChipApex. The manufacturer field lists AMD. Its product description is IC SOC CORTEX-A9 1GHZ 484FCBGA. Review the specifications below when checking this part for your BOM.

Soc System On Chip specifications for XC7Z030-3FBG484E

  • Description:IC SOC CORTEX-A9 1GHZ 484FCBGA
  • Series:Zynq®-7000
  • Mfr:AMD
  • Package:Tray
  • Architecture:MCU, FPGA
  • Core Processor:Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
  • Flash Size:-
  • RAM Size:256KB
  • Peripherals:DMA
  • Connectivity:CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
  • Speed:1GHz
  • Primary Attributes:Kintex™-7 FPGA, 125K Logic Cells
  • Operating Temperature:0°C ~ 100°C (TJ)
  • Grade:-
  • Qualification:-
  • Package / Case:484-BBGA, FCBGA
  • Supplier Device Package:484-FCBGA (23x23)

Soc System On Chip datasheet and documents for XC7Z030-3FBG484E

XC7Z030-3FBG484E

Soc System On Chip Overview

The XC7Z030-3FBG484E is a Zynq-7000 All Programmable System-on-Chip (SoC) manufactured by AMD. It integrates a dual-core ARM Cortex-A9 MPCore processor with CoreSight debug support and a Kintex-7 FPGA fabric containing 125,000 logic elements. The device operates at a maximum clock frequency of 1 GHz and features 256 KB of RAM. It utilizes a 484-pin FCBGA package measuring 23x23 mm. The component supports an operating temperature range of 0°C to 100°C TJ and includes connectivity options such as CANbus, Ethernet, I2C, SPI, UART/USART, USB OTG, MMC/SD/SDIO, and EBI/EMI.

Soc System On Chip Feature Summary

  • Integrates dual-core ARM Cortex-A9 processors with Kintex-7 FPGA programmable logic
  • Supports high-speed peripheral interfaces including Ethernet and USB OTG
  • Includes CoreSight debug architecture for system monitoring

Soc System On Chip Applications

  • Industrial automation controllers
  • Communication equipment base stations
  • Medical imaging systems
  • Automotive electronic control units

Soc System On Chip Procurement Notes

Verify the specific suffix 'E' against official AMD documentation to confirm environmental compliance status and material declarations. Confirm that the 484-FCBGA package dimensions match the target PCB footprint requirements. Ensure the 0°C to 100°C junction temperature rating aligns with the thermal design of the final assembly. Cross-reference the datasheet version to validate all electrical specifications prior to integration.

Soc System On Chip Selection Notes

Select this model when a combined processing and programmable logic solution is required within the Zynq-7000 family. The 125K logic element count suits moderate complexity designs. Verify that the 1 GHz processor speed meets real-time processing demands. Consider the 484-pin package availability if board space allows for a 23x23 mm footprint. Evaluate power consumption profiles against available cooling solutions for the intended enclosure.

Soc System On Chip Part Context

This component belongs to the Zynq-7000 series, which merges ARM processor technology with Xilinx FPGA capabilities. It represents a mid-range option in the portfolio, offering a balance between computational power and hardware flexibility. The Kintex-7 fabric provides efficient resource utilization for mixed-signal processing tasks. This series is widely adopted in embedded systems requiring deterministic hardware acceleration alongside software control.

Soc System On Chip Replacement Considerations

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$382.33
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