Soc System On Chip XC7Z030-3FBG676E product image

XC7Z030-3FBG676E

$439.79
  • Description:IC SOC CORTEX-A9 1GHZ 676FCBGA
  • Series:Zynq®-7000

SKU:55c690a38487 Category: Brand:

  
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XC7Z030-3FBG676E is listed in the Soc System On Chip range at ChipApex. The manufacturer field lists AMD. Its product description is IC SOC CORTEX-A9 1GHZ 676FCBGA. Review the specifications below when checking this part for your BOM.

Soc System On Chip specifications for XC7Z030-3FBG676E

  • Description:IC SOC CORTEX-A9 1GHZ 676FCBGA
  • Series:Zynq®-7000
  • Mfr:AMD
  • Package:Tray
  • Architecture:MCU, FPGA
  • Core Processor:Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
  • Flash Size:-
  • RAM Size:256KB
  • Peripherals:DMA
  • Connectivity:CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
  • Speed:1GHz
  • Primary Attributes:Kintex™-7 FPGA, 125K Logic Cells
  • Operating Temperature:0°C ~ 100°C (TJ)
  • Grade:-
  • Qualification:-
  • Package / Case:676-BBGA, FCBGA
  • Supplier Device Package:676-FCBGA (27x27)

Soc System On Chip datasheet and documents for XC7Z030-3FBG676E

XC7Z030-3FBG676E

Soc System On Chip Overview

The XC7Z030-3FBG676E is a System on Chip (SoC) device from the AMD Zynq-7000 series, integrating dual-core ARM Cortex-A9 processors with Kintex-7 FPGA programmable logic. It features a 1 GHz processor speed and contains 125K logic units within a 676-pin FCBGA package measuring 27x27 mm. The component supports a junction temperature range of 0°C to 100°C and includes interfaces such as Ethernet, USB OTG, I2C, SPI, UART, CANbus, and MMC/SD/SDIO.

Soc System On Chip Feature Summary

  • Integrates dual-core ARM Cortex-A9 MPCore processing system with CoreSight debug capabilities
  • Provides Kintex-7 FPGA fabric with 125K logic units for hardware acceleration
  • Supports multiple high-speed communication protocols including Ethernet and USB OTG

Soc System On Chip Applications

  • Embedded computing systems requiring combined software control and hardware acceleration
  • Industrial automation controllers utilizing real-time processing capabilities
  • Communication infrastructure equipment needing protocol handling and signal processing

Soc System On Chip Procurement Notes

Verify the specific speed grade suffix '3' against design requirements to ensure timing closure at the specified frequency. Confirm that the 676-ball FCBGA footprint matches the PCB layout constraints. Check for any recent product change notices regarding packaging or material compliance updates from the manufacturer before finalizing orders.

Soc System On Chip Selection Notes

Select this model when the application requires higher processing performance than lower-tier Zynq-7000 devices but does not necessitate the larger FPGA resources of the XC7Z100 variant. Ensure the thermal design accommodates the power dissipation associated with the 1 GHz operating frequency in the target environment.

Soc System On Chip Part Context

This component belongs to the Zynq-7000 All Programmable SoC family, which merges ARM processor technology with Xilinx FPGA architecture. It serves as a mid-range solution within the series, offering a balance between computational power and programmable logic density for versatile embedded applications.

Soc System On Chip Replacement Considerations

Compatible alternatives include other speed grades within the XC7Z030 family, such as XC7Z030-2FBG676I, provided the timing specifications meet the system requirements.

XC7Z030-3FBG676EXC7Z030-3FBG676E
$439.79
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