Soc System On Chip XC7Z045-1FFG900I product image

XC7Z045-1FFG900I

$2,111.19
  • Description:IC SOC CORTEX-A9 667MHZ 900FCBGA
  • Series:Zynq®-7000

SKU:e7e61f738809 Category: Brand:

  
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XC7Z045-1FFG900I is listed in the Soc System On Chip range at ChipApex. The manufacturer field lists AMD. Its product description is IC SOC CORTEX-A9 667MHZ 900FCBGA. Review the specifications below when checking this part for your BOM.

Soc System On Chip specifications for XC7Z045-1FFG900I

  • Description:IC SOC CORTEX-A9 667MHZ 900FCBGA
  • Series:Zynq®-7000
  • Mfr:AMD
  • Package:Tray
  • Architecture:MCU, FPGA
  • Core Processor:Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
  • Flash Size:-
  • RAM Size:256KB
  • Peripherals:DMA
  • Connectivity:CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
  • Speed:667MHz
  • Primary Attributes:Kintex™-7 FPGA, 350K Logic Cells
  • Operating Temperature:-40°C ~ 100°C (TJ)
  • Grade:-
  • Qualification:-
  • Package / Case:900-BBGA, FCBGA
  • Supplier Device Package:900-FCBGA (31x31)

Soc System On Chip datasheet and documents for XC7Z045-1FFG900I

XC7Z045-1FFG900I

Soc System On Chip Overview

The XC7Z045-1FFG900I is a Zynq-7000 SoC FPGA featuring dual ARM Cortex-A9 processors and Kintex-7 programmable logic. It integrates 800K logic cells, 2.6 Mbit Block RAM, and 38 DSP slices within a 900-pin FBGA package. The device supports industrial temperatures from -40°C to +100°C and operates with supply voltages ranging from 1.2V to 3.3V.

Soc System On Chip Feature Summary

  • Combines ARM Cortex-A9 processing system with Kintex-7 FPGA fabric for heterogeneous computing
  • Supports high-speed peripheral interfaces including Gigabit Ethernet and USB OTG
  • Enables hardware acceleration through AXI interconnect between processor and logic

Soc System On Chip Applications

  • Industrial automation controllers
  • Medical imaging systems
  • Telecommunications infrastructure

Soc System On Chip Procurement Notes

Verify the specific speed grade suffix matches design timing requirements. Confirm the industrial temperature range designation aligns with environmental specifications. Ensure the 900-ball BGA footprint compatibility is validated against the target PCB layout constraints before finalizing orders.

Soc System On Chip Selection Notes

Select this model when requiring higher logic density than lower-tier Zynq devices while maintaining dual-core processing capabilities. Evaluate power consumption profiles against available cooling solutions. Compare resource utilization needs against alternative packages to optimize board space and cost efficiency.

Soc System On Chip Part Context

This component belongs to the Xilinx Zynq-7000 family, bridging software-defined processing and programmable logic. It represents a mid-range solution in the series, offering balanced performance for complex embedded applications requiring both control and parallel data processing capabilities.

Soc System On Chip Replacement Considerations

XC7Z045-1FFG900E

Soc System On Chip FAQ

What is the maximum operating junction temperature?

The maximum operating junction temperature is +100°C.

How many DSP slices are included?

The device includes 38 DSP slices.

XC7Z045-1FFG900IXC7Z045-1FFG900I
$2,111.19
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