Soc System On Chip XC7Z045-2FBG676E product image

XC7Z045-2FBG676E

$1,688.31
  • Description:IC SOC CORTEX-A9 800MHZ 676FCBGA
  • Series:Zynq®-7000

SKU:aedfb81574a4 Category: Brand:

  
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XC7Z045-2FBG676E is listed in the Soc System On Chip range at ChipApex. The manufacturer field lists AMD. Its product description is IC SOC CORTEX-A9 800MHZ 676FCBGA. Review the specifications below when checking this part for your BOM.

Soc System On Chip specifications for XC7Z045-2FBG676E

  • Description:IC SOC CORTEX-A9 800MHZ 676FCBGA
  • Series:Zynq®-7000
  • Mfr:AMD
  • Package:Tray
  • Architecture:MCU, FPGA
  • Core Processor:Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
  • Flash Size:-
  • RAM Size:256KB
  • Peripherals:DMA
  • Connectivity:CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
  • Speed:800MHz
  • Primary Attributes:Kintex™-7 FPGA, 350K Logic Cells
  • Operating Temperature:0°C ~ 100°C (TJ)
  • Grade:-
  • Qualification:-
  • Package / Case:676-BBGA, FCBGA
  • Supplier Device Package:676-FCBGA (27x27)

Soc System On Chip datasheet and documents for XC7Z045-2FBG676E

XC7Z045-2FBG676E

Soc System On Chip Overview

The XC7Z045-2FBG676E is a System on Chip (SoC) from the AMD Zynq-7000 family, integrating dual-core ARM Cortex-A9 processors with Kintex-7 FPGA fabric. It operates at a maximum processor frequency of 866 MHz and contains 130K logic cells within the programmable logic section. The device utilizes a 676-pin FCBGA package measuring 27x27 mm. Key specifications include 256 KB of On-Chip Memory (OCM), support for DDR3/DDR3L memory interfaces, and an operating temperature range of 0°C to 100°C.

Soc System On Chip Feature Summary

  • Heterogeneous architecture combining hardened ARM Cortex-A9 processing system with Kintex-7 programmable logic
  • Integrated high-speed peripheral controllers including Gigabit Ethernet MACs and USB OTG
  • Support for multiple external memory types including DDR3 and LPDDR2 via PS interfaces
  • CoreSight debug infrastructure embedded within the processing system

Soc System On Chip Applications

  • Industrial automation and control systems requiring real-time processing
  • Medical imaging equipment needing hardware-accelerated signal processing
  • Automotive infotainment and advanced driver assistance systems
  • Test and measurement instruments utilizing FPGA parallelism

Soc System On Chip Procurement Notes

Verify the specific speed grade suffix '2' against design timing requirements. Confirm the 'E' suffix indicates commercial temperature range suitability. Ensure the 676-ball FCBGA footprint matches the PCB layout. Check for RoHS compliance documentation. Validate that the source provides original manufacturer packaging to prevent counterfeit components.

Soc System On Chip Selection Notes

Select this model when Kintex-7 resource density is required alongside ARM processing capabilities. Compare logic cell counts against Artix-7 based Zynq models for capacity needs. Evaluate power consumption profiles against higher-end Virtex-based SoCs. Consider pin count limitations relative to I/O requirements. Assess thermal management solutions for the 27x27 mm package.

Soc System On Chip Part Context

This component belongs to the Zynq-7000 All Programmable SoC portfolio, bridging the gap between standard microprocessors and discrete FPGAs. It succeeds earlier Zynq-100 series devices by offering enhanced performance through the 28nm HPC process technology. The XC7Z045 variant sits in the mid-range of the family, providing balanced resources for complex embedded applications.

Soc System On Chip Replacement Considerations

XC7Z045-1FBG676E offers a lower speed grade option. XC7Z045-2FFG676I provides industrial temperature rating instead of commercial. XC7Z030-2FBG676E serves as a lower-resource alternative within the same package. XC7Z045-2FBG676I is the industrial-grade equivalent.

XC7Z045-2FBG676EXC7Z045-2FBG676E
$1,688.31
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