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XC7Z045-3FFV676E is listed in the Soc System On Chip range at ChipApex. The manufacturer field lists AMD. Its product description is IC SOC CORTEX-A9 1GHZ 676FCBGA. Review the specifications below when checking this part for your BOM.
The XC7Z045-3FFV676E is a Zynq-7000 All Programmable System-on-Chip (SoC) manufactured by AMD. It integrates dual-core ARM Cortex-A9 MPCore processors with Kintex-7 FPGA programmable logic on a single die. The device features 185K logic cells, 253,912 LUTs, and 507,824 flip-flops within the programmable logic section. It includes 19 Mbit of embedded block RAM and 220 DSP slices. The processing system supports up to 1 GHz operation speed and provides interfaces including Ethernet, USB OTG, CANbus, I2C, SPI, UART, and SD/SDIO. The component operates at a supply voltage of 850 mV and functions within a temperature range of 0°C to +100°C.
Verify the specific suffix 'E' indicates the extended temperature or commercial grade variant as defined in official datasheets. Confirm package integrity upon receipt, as the FBGA-676 package is sensitive to moisture. Check RoHS compliance documentation against current regulatory requirements before integration into final assemblies.
Select this model when design requirements exceed Artix-7 capabilities but do not necessitate Virtex-7 resources. Compare logic density and DSP slice counts against alternative Zynq-7000 variants like the XC7Z030 or XC7Z045. Ensure power budget calculations account for both PS and PL domains using appropriate estimation tools.
This component belongs to the Zynq-7000 family, which combines ARM processor technology with Xilinx FPGA architecture. It represents a mid-to-high-end solution within the series, offering significant programmable logic resources compared to lower-density counterparts while maintaining compatibility with standard Zynq development tools and software environments.
Direct functional replacements within the same package include other XC7Z045 variants with different speed grades or temperature ratings. Cross-family migration to Versal devices requires architectural redesign due to differences in processing system and interconnect structures.
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