Soc System On Chip XC7Z100-2FFG900I product image

XC7Z100-2FFG900I

$2,977.13
  • Description:IC SOC CORTEX-A9 800MHZ 900FCBGA
  • Series:Zynq®-7000

SKU:686243a3d882 Category: Brand:

  
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XC7Z100-2FFG900I is listed in the Soc System On Chip range at ChipApex. The manufacturer field lists AMD. Its product description is IC SOC CORTEX-A9 800MHZ 900FCBGA. Review the specifications below when checking this part for your BOM.

Soc System On Chip specifications for XC7Z100-2FFG900I

  • Description:IC SOC CORTEX-A9 800MHZ 900FCBGA
  • Series:Zynq®-7000
  • Mfr:AMD
  • Package:Tray
  • Architecture:MCU, FPGA
  • Core Processor:Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
  • Flash Size:-
  • RAM Size:256KB
  • Peripherals:DMA
  • Connectivity:CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
  • Speed:800MHz
  • Primary Attributes:Kintex™-7 FPGA, 444K Logic Cells
  • Operating Temperature:-40°C ~ 100°C (TJ)
  • Grade:-
  • Qualification:-
  • Package / Case:900-BBGA, FCBGA
  • Supplier Device Package:900-FCBGA (31x31)

Soc System On Chip datasheet and documents for XC7Z100-2FFG900I

XC7Z100-2FFG900I

Soc System On Chip Overview

The XC7Z100-2FFG900I is a Zynq-7000 SoC FPGA featuring a dual-core ARM Cortex-A9 Processing System and Kintex-7 Programmable Logic. It operates at a maximum clock frequency of 766 MHz with 444,000 logic elements (69,350 ALMs) and 26.5 Mbit embedded memory. The device provides 362 I/Os in an FCBGA-900 package, supporting industrial temperatures from -40°C to +100°C.

Soc System On Chip Feature Summary

  • Integrates dual-core ARM Cortex-A9 processors with high-speed AXI interconnect to Kintex-7 FPGA fabric for heterogeneous computing.
  • Provides extensive programmable logic resources including significant block RAM and DSP slices for hardware acceleration.
  • Supports diverse peripheral interfaces including Ethernet, USB OTG, SPI, I2C, and UART within a single chip.

Soc System On Chip Applications

  • Industrial automation and control systems requiring real-time processing
  • Software-defined radio and communication infrastructure
  • Medical imaging and healthcare equipment signal processing

Soc System On Chip Procurement Notes

Verify the specific suffix 'I' confirms industrial temperature range compliance (-40°C to +100°C). Confirm the speed grade '-2' matches system timing requirements. Ensure the FCBGA-900 package dimensions align with PCB layout constraints. Cross-reference the manufacturer datasheet for moisture sensitivity levels and reflow soldering profiles prior to assembly.

Soc System On Chip Selection Notes

Select this model when high-performance heterogeneous processing is required within a compact form factor. The dual-core ARM architecture suits complex software tasks while the FPGA handles parallel data streams. Consider thermal management solutions due to the high logic density and power consumption inherent in the Kintex-7 architecture under heavy load conditions.

Soc System On Chip Part Context

This component belongs to the AMD Xilinx Zynq-7000 family, representing a flagship SoC combining processor and programmable logic. It utilizes 28nm technology to deliver high performance in a 45x45mm footprint. The part integrates the Processing System and Programmable Logic on a single die for efficient data transfer.

Soc System On Chip Replacement Considerations

Consult official AMD substitution guides for verified equivalents. Alternative models within the Zynq-7000 series may offer different logic densities or speed grades but require pinout and resource verification.

XC7Z100-2FFG900IXC7Z100-2FFG900I
$2,977.13
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