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XC9572-15TQG100I is listed in the Complex Programmable Logic Devices range at ChipApex. The manufacturer field lists AMD. Its product description is IC CPLD 72MC 15NS 100TQFP. Review the specifications below when checking this part for your BOM.
The XC9572-15TQG100I is a Complex Programmable Logic Device (CPLD) belonging to the Xilinx XC9500XL family. It features 7,680 system gates and supports up to 84 user I/O pins within a 100-pin TQFP package. The device utilizes non-volatile Flash memory technology for configuration retention without external battery support. Key electrical specifications include a maximum propagation delay of 15 ns and operation across a supply voltage range of 2.7V to 3.6V. It supports in-system programming via JTAG interface.
Verify the specific suffix 'I' indicates industrial temperature range compliance (-40°C to +85°C). Confirm package integrity for the 100-pin Thin Quad Flat Package (TQFP). Ensure sourcing channels provide genuine Xilinx components to avoid counterfeit risks associated with older CPLD families. Check for RoHS compliance status if required by current manufacturing standards.
Select this component when non-volatile configuration is required without external PROMs. Compare gate density against XC9536XL or XC95144XL variants based on pin count and logic requirements. Consider the 15ns speed grade for timing-critical paths. Evaluate power consumption differences between 5V and 3.3V versions if system voltage constraints exist.
This part belongs to the XC9500XL series, an evolution of the original XC9500 family featuring Flash memory instead of EEPROM. It serves as a drop-in replacement for many standard logic functions previously handled by discrete gates or complex PLDs. The TQFP100 package offers a balance of pin count and board space efficiency for medium-complexity designs.
Direct pin-compatible replacements may include other XC9500XL variants with higher gate counts such as XC95144 or XC95288, provided pin assignments are remapped. Legacy XC9500 devices require external configuration memory and are not direct substitutes. Verify that alternative packages maintain the same thermal and mechanical specifications.
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