XCAU25P-2FFVB676E

Field Programmable Gate Array Overview

The AMD XCAU25P-2FFVB676E is an Artix UltraScale+ Field Programmable Gate Array (FPGA) designed for high-performance, cost-sensitive applications. It features 308,437 logic elements and 17,625 Adaptive Logic Modules (ALMs). The device includes 10.5 Mbits of embedded memory and supports up to 292 I/Os. Operating with a core voltage range of 825 mV to 876 mV, it functions within a temperature range of 0°C to +100°C. Data rates reach 12.5 Gb/s, supported by 12 transceivers. It is housed in a 676-ball FCBGA package.

Field Programmable Gate Array Feature Summary

• Artix UltraScale+ architecture providing advanced low-power performance
• High-density logic resources with significant adaptive logic module capacity
• Integrated high-speed serial transceivers for complex data transmission
• Extensive embedded memory blocks for efficient data buffering

Field Programmable Gate Array Applications

• Machine vision systems requiring high bandwidth processing
• Security network infrastructure components
• 4K broadcast equipment
• Industrial IoT edge computing nodes

Field Programmable Gate Array Procurement Notes

Verify the specific suffix codes against official AMD documentation to ensure correct speed grade and operating temperature range. Confirm package dimensions and pinout compatibility during integration planning. Request current RoHS compliance declarations and material content statements from authorized distributors prior to final procurement decisions.

Field Programmable Gate Array Selection Notes

Compare resource utilization against design requirements to ensure optimal fit within the 308k LE capacity. Evaluate power consumption profiles relative to the 825mV to 876mV supply constraints. Consider thermal management solutions suitable for the 0°C to +100°C operational envelope when selecting this component over lower-density alternatives.

Field Programmable Gate Array Part Context

This component belongs to the Artix UltraScale+ family, bridging the gap between entry-level Spartan devices and higher-end Kintex or Virtex series. It targets applications needing substantial logic density and high-speed I/O without the premium cost associated with larger families. The 676-ball BGA package offers a balance between pin count and board space efficiency.