XCF02SVO20C0100

Overview

The XCF02SVO20C0100 is a 2 Mbit Serial PROM designed for FPGA configuration, manufactured by AMD. It operates at 3.3V and features In-System Programmability (ISP) via SPI interface. The device is housed in a 20-TSSOP package with a width of 4.40mm. It supports surface mount mounting and functions within an operating temperature range of -40°C to 85°C. The component has a Moisture Sensitivity Level (MSL) of 3, allowing for 168 hours of exposure before reflow soldering.

Feature Summary

• Supports In-System Programmability for flexible FPGA configuration updates
• Utilizes SPI serial interface for efficient data transfer
• Designed for surface mount applications in compact electronic assemblies

Applications

• Configuration of Field Programmable Gate Arrays (FPGAs)
• Industrial control systems requiring reliable non-volatile storage
• Embedded designs needing ISP capabilities for field updates

Procurement Notes

Verify the obsolete status of this part number through official AMD channels before procurement planning. Confirm that the 20-TSSOP package dimensions align with your PCB footprint requirements. Ensure compatibility with existing SPI programming tools for ISP operations. Check for available replacement options if long-term supply stability is required for production cycles.

Selection Notes

Select this component when a 2 Mbit capacity is sufficient for FPGA configuration needs. The 3.3V operation voltage must match the target system's power rails. Consider the 20-TSSOP package size for board space constraints. Verify that the industrial temperature range meets environmental conditions. ISP capability is essential if field programmability is a design requirement.

Part Context

This part belongs to the AMD XCF series of Serial PROMs specifically engineered for configuring Xilinx FPGAs. It provides non-volatile storage for configuration data, ensuring the FPGA initializes correctly upon power-up. The series is known for supporting various FPGA families, offering a standardized solution for configuration memory needs in embedded electronics.

Replacement Considerations

Consult AMD documentation for direct pin-compatible or functionally equivalent replacements. Verify that any substitute maintains the 2 Mbit capacity and 3.3V operation. Ensure the new component supports ISP if that feature is critical. Check package compatibility to avoid PCB redesign.