XCF128XFTG64C

Overview

The XCF128XFTG64C is a PROM SRL component manufactured by Xilinx, now part of AMD. It features a memory density of 134,217,728 bits and utilizes a 64-pin TBGA package with dimensions of 8x8 mm. The device supports asynchronous read mode and includes a command user interface. The maximum access time is specified at 85 ns. This flash memory integrated circuit is designed for configuration applications requiring non-volatile storage capabilities within the specified package constraints.

Feature Summary

• Supports asynchronous read mode for data retrieval
• Includes a command user interface for operational control
• Utilizes a compact 64-pin Thin BGA package

Applications

• FPGA configuration storage
• System boot code storage
• Embedded system configuration

Procurement Notes

Verify the manufacturer designation as Xilinx when sourcing this component, as it was produced prior to the full integration into AMD's portfolio. Confirm the specific suffix 'G' indicates lead-free compliance if required by assembly standards. Ensure the package type matches the 64-pin FTBGA specification for PCB footprint compatibility during procurement planning.

Selection Notes

Select this component when a high-density serial PROM is required for FPGA configuration or embedded storage. The 128M gate capacity provides substantial storage for complex logic designs. Consider the 85 ns access time for timing requirements in the target system architecture. The 64-pin form factor suits space-constrained designs needing robust non-volatile memory solutions.

Part Context

This component belongs to the XCF series of PROM devices originally developed by Xilinx. These parts are widely used for configuring Xilinx FPGAs and CPLDs. Although AMD now owns the product line, the technical specifications and naming conventions remain consistent with the original Xilinx documentation. The device serves as a critical non-volatile storage element in digital logic systems.

Replacement Considerations

Consult official Xilinx/AMD documentation for direct pin-compatible substitutes within the XCF family. Verify that any replacement maintains the same 128M gate density and 64-pin package configuration. Cross-reference electrical characteristics to ensure compatibility with the target FPGA or CPLD configuration interface.